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High Frequency Rogers 4003c Rogers 5880 Pcb Board Electronics PCB Design
Detailed for Pcb Assembly
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technolog
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity
PCB capability:
Specification | |
Numbr of Layer | 1-18Layers |
Material | FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate |
Surface Finish | HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) |
Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
Copper Thickness | 1/2 oz min;12 oz max |
Solder Mask | Green/Black/White/Red/Blue/Yellow |
Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
Min.Hole Diameter for CNC Driling | 0.1mm(4mil) |
Min.Hole Diameter for punching | 0.9mm(35mil) |
Biggest panel size | 610mm*508mm |
Hole Positon | +/-0.075mm(3mil) CNC Driling |
Conductor Width(W) | 0.05mm(2mil)or; +/-20% of original artwork |
Hole Diameter(H) | PTH L:+/-0.075mm(3mil); Non-PTH L:+/-0.05mm(2mil) |
Outline Tolerance | 0.125mm(5mil) CNC Routing; +/-0.15mm(6mil) by Punching |
Warp & Twist | 0.70% |
Insulation Resistance | 10Kohm-20Mohm |
Conductivity | <50ohm |
Test Voltage | 10-300V |
Panel Size | 110×100mm(min);660×600mm(max) |
Layer-layer misregistration | 4 layers:0.15mm(6mil)max; 6 layers:0.25mm(10mil)max |
Min.spacing between hole edge to circuity pqttern of an inner layer | 0.25mm(10mil) |
Min.spacing between board oulineto circuitry pattern of an inner layer | 0.25mm(10mil) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil); 6 layers:+/-0.15mm(6mil) |
Impedance Control | +/-10% |
Our more than 80% are automated production equipment, improves the production efficiency and product quality.And a variety of famous brand equipment is used in all processes, including Drilling, Electroless Plating, Electroplating, Etching, Solder Mask, Silk Screen, Chemical Gold, Electrolytic Gold, CNC Profiling,Electrical Testing, and Packing.
The PCBA used in telecomunications, automotive electronics, 3G/4G/5G products, IOT products, AI smart control products, RF, networking, security, Inudstrial control, medical Instrumentation, military products, computer peripherals and other high-teach fields.
Shenzhen Yideyi Technology Co., Ltd provide one-stop PCBA service, such as 0201/BGA/CCGA surface-mount(smt),thru-hole(tht),mixed technology (smt&thru-hole), conformal coating, potting and encapsulations, AOI/X-Ray PCBA testing, IC programming, box building service, etc.
YDY have great reputation from our customers around the world.
FAQ:
Q1. How can we ensure our information should not let third party to
see our design?
We are willing to sign NDA effect by customer side local law and
promising to keep customers date in high confidential level in all
projects.
Q2. What service do you have?
We provide turnkey solution including RD, PCB fabrication, SMT,
final assembly,testing and other value-added service.
Q3. Please note that the following detail will speed up evaluation:
Material:
Board thickness:
Copper thickness:Surface finish:
Solder mask color:
Silkscreen color:
Q4. How about the delivery?
Normally, for sample order, our delivery is about 5 days.For small
batch, our delivery is about 7 days.
For mass production batch, our delivery is about 10 days.
But that depends on the real condition when we get your order.
If your order is urgently please contact us directly ,we will
priority to deal it and do ourbest to give you satisfied delivery
time.
Q5. With payment terms do we accept?
For sample order or small batch, we suggest you to use Pay-pal and
Western Union.For mass production batch, we suggest you to use T/T.
Q6. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the
function test.Before that, our inspectors will use microscope and
X-ray to check the IC footwelding or bad solder etc.