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Dc Controller Pcb Board Assembly PCBA Prototype Pcba Contract Manufacturing
Shenzhen Yideyi Technology Co., Ltd is a China Manufacturer with main products: Print Circuit Board, PCBA, PCBA Assembly, PCBA Design, PCBA Layout, PCBA Copy, Multilayer PCBA, SMT DIP PCBA.
Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe.
Production Requirement for pcb assembly:
1.Gerber Files (Eagle and PCB File are available).
2.BOM list.
3.Clear pictures of PCBA or PCBA samples to us.
4.Pick N Place file.
5.Test procedure for PCBA.
PCBA Capability
Items | PCB capacity |
Product name | SMT circuit board manufacturer custom electronic assembly pcb pcba |
Material | FR-4; High TG FR-4; Aluminum; CEM-1; CEM-3; Rogers, etc |
PCB type | Rigid, flexible, rigid-flexible |
Layer NO. | 1, 2, 4, 6, up to 24 layer |
Shape | Rectangular, round, slots, cutouts, complex, irregular |
Max PCB dimensions | 1200mm*600mm |
Board Thickness | 0.2mm-4mm |
Thickness Tolerance | ±10% |
Min Hole Size | 0.1mm (4 mil) |
Copper Thickness | 0.5 OZ-3OZ (18 um-385 um) |
Copper Plating hole | 18um-30um |
Min Trace Width | 0.075mm (3mil) |
Min Space Width | 0.1mm (4 mil) |
Surface finish | HASL, LF HASL, Imm Gold, Imm Silver, OSP etc |
Solder mask | Green, red, white, yellow, blue, black, orange, purple |
Our rapid PCBA prototyping service supports quantities of 1 to 1000 boards with no minimum quantity requirement. Request a quote in minutes, see your quote in hours, and have a fully assembled board in days.
Quality is assured with our full in-house DFx team and Flight rated quality management system. Sourcing is fully China based from rigorously qualified suppliers.
We also use professional device to eliminate risk for each of the items referenced in your Bill of Materials:
Lifecycle (EOL) Information
Cross reference information
Supplier P/N & Name Validation
RoHS/REACH Data
Risk Analysis Information
Product Change Information
YDY serves the world’s most innovative companies, from global enterprises to fast moving startups. Our software-driven process allows companies to get to market faster and with confidence.
Our rapid PCBA prototyping service supports quantities of 1 to 250 boards with no minimum quantity requirement. Request a quote in minutes, see your quote in hours, and have a fully assembled board in days. Quality is assured with our full in-house DFx team and Flight rated quality management system. Sourcing is fully USA based from rigorously qualified suppliers.
Production level quality control at quick turn speeds.
YDY has IPC Class 2, Class 3, Class 3+ rated production. Certified ISO 9001:2015, AS9100D, and ISO 13485:2016 and ITAR registered.
FAQ:
Q1. What kinds of boards can O-Leading process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon,
aluminum/copper-based boards, PI, etc
Q2. What kind of PCB file format can you accept for production?
Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)
Q3. How do we ensure quality?
Our high quality standard is achieved with the following.
1. The process is strictly controlled under ISO 9001:2008
standards.
2. Extensive use of software in managing the production process
3. State-of-art testing equipments and tools. E.g. Flying Probe,
X-ray Inspection, AOI (Automated Optical Inspector) and ICT
(in-circuit testing).
4. Dedicated quality assurance team with failure case analysis
process
5. Continuous staff training and education
Q4. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the
function test.Before that, our inspectors will use microscope and
X-ray to check the IC footwelding or bad solder etc.
Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine,
Pressing machine, VCP line, Automatic Exposing machine, LDI and
etc.
Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI →
Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel
Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer
AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T
→ Visual Inspection.