ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

Brand Name:ASM
Model Number:NOVA Plus
Minimum Order Quantity:1 unit
Payment Terms:20% deposit - 80% before delivery
Place of Origin:China
Packaging Details:Wooden Box
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Location: Shenzhen China
Address: Rm. 201, Building 20, Tantou Western Industrial Park, Shajing, Bao an District, Shenzhen, China
Supplier`s last login times: within 1 hours
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ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used


ASM NOVA Plus Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder


ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more. The Nova Plus Die Bonder / Flip Chip Bonder has a wide range of features.


Infinite Automation has a big quantity of stock for Semiconductor related equipment. Among our featured machines are original and used ASM NOVA Plus Die Bonder and Flip Chip Bonder. Infinite Automation has more than 200 hundred units of Die Bonding and Die Attach, and Wire Bonding machines available. Infinite Automation is a trusted China supplier of best-conditioned pre-owned factory automation machines and production line equipment. Contact our Sales and Customer Support Team for inquiries.


ASM NOVA Plus Die Bonder and Flip Chip Bonder


Dimensions

W x D x H

1240 x 2140 x 1980 mm


Features:

  • high precision die bonder / flip chip bonder
  • accuracy +/- 2.5 µm @ 3s
  • a cycle- time of < 3 sec*
  • modular machine concept for all micro-assembly applications
  • eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing
  • multi flip-chip bonding
  • wafer mapping
  • post bond inspection/ measurement
  • substrate working area of 550 x 600 mm
  • active bond-force-control

Autoloading for up to:

  • 12" wafers
  • 300 mm wafers
  • 450 mm substrate wafers

Optional:

  • UV- Curing
  • Dispensing

... and more!


The Nova Plus Die Bonder / Flip Chip Bonder is designed for the following markets:

  • Semiconductor advanced packaging- (TSV, eWLB, Fan-Out, WLP, 3D, Stack Die)
  • MEMS
  • Automotive Sensors
  • RFID
  • LED
  • Optoelectronic


China ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used supplier

ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

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