Single Step Pumping SMT Vacuum Reflow Oven For BGA Soldering

Brand Name:Seprays
Certification:CE, RoHS
Model Number:ZM-KT100
Minimum Order Quantity:1 Set
Delivery Time:15-30 days
Payment Terms:L/C, T/T, Western Union, MoneyGram
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Location: Dongguan Guangdong China
Address: 5th Floor, B2 Building Research Center Songshan Lake Intelligent Valley, Liaobu Town, Dongguan City, Guangdong Province.
Supplier`s last login times: within 20 hours
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Product Details

Big Size Hot Air Reflow Oven With 12 Heating Zones PCB Soldering Machine


Reflow Oven Features:

1. Reflow Oven is optimized design and advanced technology, excellent and precise manufacturing;
2. Advanced technology application and creation to reassure the best machine performance;
3. Adhering to the rigorous and pragmatic tradition of equipment manufacturing, the machine is durable with good reputation and low failure rate;

4. The most efficient heating and conduction, allows ΔT control inside the chamber to be ±1℃

5. The exclusive patented flux collection system makes the chamber clean, reduce maintenance time and cost;

Intelligent nitrogen monitoring and control system and valve control, according to the oxygen content in the chamber, automatically adjust valve opening ratio (from 0---100%) to ensure the chamber stability, also to save the nitrogen consumption to maximum. Our nitrogen consumption is only 50% of other competitors, helping customers to control the production cost of nitrogen consumption;

6. High performance and durable seals are used, advanced design ensures good air tightness, the oven achieves a minimum of 20 PPM oxygen content, and keep the set values very well;

7. User-friendly operation interface, advanced touch screen technology; using USB to secure installation, software backup, easy to operate. Program backup, restore, data import& export, save all the time information of the software system to facilitate engineers to track and share any anomalies; there is an optional MES system for easy tracking the situation of the products in the oven (widely used in automotive and other important industry);

8. Automatic switch on/off function, convenient for operators to save time, especially for one-shift production (for example, setting the automatic startup at 7:00 a.m. on Monday morning and 6:00 p.m. automatic shutdown);

9. Wide range of applications for all SMT production soldering processes. Preheating zone can be set to a maximum of 300-350 ℃, vacuum zone can be set to a maximum of 300 ℃.

10. Patented in-line vacuum system, can reduce void rate by 99%. The standard width of vacuum chamber is 510

Reflow Oven SPECIFICATION

ModelZM-KT100
WeightApprx:2500KG
Dimension6025×1350×1500mm
Heating zone qty.

Top10/ bottom 10


Cooling zone qty.Top 4/ bottom 4
Cooling wayForced water cooling
Rectifying plate structureCarbon heating plate
Exhausting requirement10/min×2
Control system
Power supply3P 380V 50/60HZ
Total power54KW
Startup power38KW
Consumption power12KW
Speed adjusting3 sections with 3 inverters
Warm up timeApprx.20minute
Temp. control rangeRoom temp.300℃ (adjustable)
Temp. control accuracy±1℃
PCB temp. deviation±1.5℃
Data storeCan store unlimited setting parameters
Abnormal alarmHigh temp., low temp., conveying, vacuum pressure, nitrogen, air volume, PCB entering abnormal
Conveying system
Rail structureSeparately controlled in 3 sections
PCB max. width400mm*350mm
Conveyor height900±200MM
Conveying wayChain
Vacuum system
Vacuum min. pressure0 .1MP
Vacuum pump power3KW rotary vane wet
Vacuum pressure relief time10S
Vacuuming time10-300S
Vacuum chamber open wayElectric
Vacuum chamber size500*400*300mm
Production beat20S
Nitrogen system (option)
Nitrogen periodThe whole production time
Nitrogen concentration500-1000PPM
Nitrogen consumption15-30m³

China Single Step Pumping SMT Vacuum Reflow Oven For BGA Soldering supplier

Single Step Pumping SMT Vacuum Reflow Oven For BGA Soldering

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