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SMT 99.9% accuracy SMT PCB X-Ray Inspection Equipment X Ray Machine for LED TV Product Line
Introduction
X-Ray uses a cathode ray tube to generate high-energy electrons to
collide with a metal target. During the collision process, due to
the sudden deceleration of the electrons, the lost kinetic energy
will be released in the form of X-Ray. For the position of the
sample that cannot be detected by appearance, the change of light
intensity after X-Ray penetrates materials of different densities
is used to record the change of light intensity. Observe the
problematic area inside the analyte while destroying the analyte.
What is the principle of X-RAY equipment detection?
The detection principle of X-RAY equipment is basically X-ray
projection microscope. Under the action of high voltage, the X-ray
emission tube generates X-rays through the test sample (such as PCB
board, SMT, etc.), and then according to the density and atomic
weight of the sample material itself, and the X-rays will also have
different absorption. amount to produce an image on the image
receiver. The density of the measured workpiece determines the
intensity of the X-ray, and the higher the density, the darker the
shadow. The closer the X-ray tube is, the larger the shadow, and
vice versa, the smaller the shadow, which is the principle of
geometric magnification. Of course, not only the density of the
workpiece has an influence on the intensity of X-rays, but also the
intensity of X-rays can be adjusted through the voltage and current
of the power supply on the console. The operator can freely adjust
the imaging situation according to the imaging situation, such as
the display size of the image, the brightness and contrast of the
image, etc., and can also freely adjust and detect the part of the
workpiece through the automatic navigation function.
Features:
The device is cost-effective and supports flexible selection of
enhancers and high-definition FPD
The system has 600X magnification for high-definition real-time
imaging
User-friendly interface, various functions, and support for
graphical results
Support optional CNC high-speed movement automatic measurement
function
The standard configuration
●4/2 (optional 6-inch) image intensifier and megapixel digital
camera;
●90KV/100KV-5 micron X-ray source;
●Simple mouse click operation to write detection program;
●High detection repeatability;
Rotation and tilt of plus or minus 60 degrees, allowing a unique
viewing angle to detect samples;
●High-performance stage control;
●Large navigation window - easy to locate and identify defective
products;
●Automatic BGA detection program detects the bubbles of each BGA,
makes judgments according to customer requirements and outputs
Excel reports.
Purpose:
Defect detection of internal cracks and foreign objects in metal
materials and parts, plastic materials and parts, electronic
components, electronic components, LED components, etc., analysis
of internal displacement of BGA, circuit boards, etc.; Defects,
microelectronic systems and sealing components, cables, fixtures,
internal analysis of plastic parts.
Application range:
IC, BGA, PCB/PCBA, surface mount process solderability testing,
etc.