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±20 μm Precision FPC Laser Cutting Machine For PCB Board Manufacturing Process FPC Laser Cutting Machine Parameter
Parameter | ||
Technical parameters | Main body of laser | 1480mm*1360mm*1412 mm |
Weight of machine | 1500Kg | |
Power | AC220 V | |
Laser | 355 nm | |
Laser | Optowave 10-20W(US) | |
Material | ≤1.2 mm | |
Precision | ±20 μm | |
Positioning | ±2 μm | |
Platform | ±2 μm | |
Working area | 450*430 mm | |
Maximum | 3 KW | |
Vibrating | CTI(US) | |
Power | AC220 V | |
Diameter | 20±5 μm | |
Ambient | 20±2 ℃ | |
Ambient | <60 % | |
The Machine | Marble |
FPC Laser Cutting Machine Features:
1. Neat and smooth edge, no burr or overflow
2. More quick and easy, shorten the delivery time
3. High quality ,no distortion,surface clean& uniformity;
4. Gathering the CNC tech,laser tech,software tech…High accuracy, High speed.
FPC Laser Cutting Machine Advantages:
FPC Laser Cutting Machine Application:
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.