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0.25mm ENIG Metal Core Printed Circuit Board Pcb Fabrication
Service
Metal Core Printed Circuit Board High Density Interconnect Pcb
Fabrication Service
FASTPCBA Electronics Co., Ltd. is a professional PCB manufacturer
in China, Shenzhen. With 20 years of development, FASPCBA turns
into a first class manufacturer of HDI PCB, with production
capability 35,000 square meters. FASTPCBA is providing high quality
bare PCB and PCB assembly service,including components sourcing,
function test,conformal coating and complete assembly for clients
all over the world, Our main market is Europe, north USA,
Australia, South America, and Asia.
FASTPCBA has been selected as the “excellent partner of the year”
by numerous well-known enterprises, and won many domestic and
authorized certifications at home and abroad, such as Chinese
high-tech project certification, ISO9001, ISO14001, ISO13485,
IATF16949 quality management system standard and customized CE, UL,
FCC and other product certifications according to the customer's
requirements.
High Density Interconnector Pcb Manufacturing
HDI high-frequency circuit board is a circuit board with a
relatively high line distribution density using micro-blind buried
hole technology. It is designed for compact electronic products for
small-capacity users.
It adopts modular design for parallel connection. The capacity of
one module is 1000VA (height 1U). It is naturally cooled and can be
directly put into a 19″ rack. It can connect up to 6 modules in
parallel.
Using all-digital signal processing (DSP) technology and a number
of patented technologies, it has a full range of load capacity and
strong short-term overload capability, regardless of the load power
factor and crest factor.
HDI printed circuit board is a structural element formed by
insulating material supplemented by conductor wiring.
HDI PCB manufacturing capabilities:
Plate material | Copper foil without glass fiber, FR4 |
PCB layers | 1-48 layers |
Board thickness | 2.0±0.15mm |
Minimum aperture | 0.1mm |
Surface treatment | ENIG |
BGA size | 0.25mm |
Surface Finishing | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card |
Minimum line width/distance | 0.13mm/0.15mm |
Blind hole structure | 1-2 layers, 2-3 layers, 3-4 layers, 9-10 layers, 10-11 layers, 11-12 layers |
Process characteristics | HDI blind buried hole process, high BGA density, small hole-to-line spacing |
We have imported the advanced machinery from US,Japan,German and
Israel to improve our production and technical ability.We have set
a great example the PCB field of flying probe testing,buried and
blind via and special controlled impedance.We have a highly
developed R&D division which has helped our factory
successfully produce mechanical micro via,high density impedance
and HDI.
Millions of circuit boards are produced here every year, which
provides superior service for automotive electronics, medical
electronics, power communications, industrial automation,
intelligent home and other industries around the world. We will
continue to improve our quality and service; customer satisfaction
and development of science and technology are our eternal
motivation.