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A basic PCB consists of a flat sheet of insulating material and a layer of copper foil, laminated to the substrate. Chemical etching divides the copper into separate conducting lines called tracks or circuit traces, pads for connections, vias to pass connections between layers of copper, and features such as solid conductive areas for electromagnetic shielding or other purposes. The tracks function as wires fixed in place, and are insulated from each other by air and the board substrate material. The surface of a PCB may have a coating that protects the copper from corrosion and reduces the chances of solder shorts between traces or undesired electrical contact with stray bare wires. For its function in helping to prevent solder shorts, the coating is called solder resist or solder mask.
PCB Capability
Article | Description | Capability |
Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... |
Board Cutting | Number of layers | 1-48 |
Min.thickness for inner layers (Cu thickness are excluded) | 0.003”(0.07mm) | |
Board Thickness | Standard | (0.1-4mm±10%) |
Min. | Single/Double:0.008±0.004” | |
4layer:0.01±0.008” | ||
8layer:0.01±0.008” | ||
Bow and twist | no more than 7/1000 | |
Copper Weight | Outer Cu weight | 0.5-4 0z |
Inner Cu weight | 0.5-3 0z | |
Drilling | Min size | 0.0078”(0.2mm) |
Drill deviation | ±0.002″(0.05mm) | |
PTH hole tolerance | ±0.002″(0.005mm) | |
NPTH hole tolerance | ±0.002″(0.005mm) | |
Solder Mask | Color | Green,white,black,red,blue… |
Min solder mask clearanace | 0.003″(0.07mm) | |
Thickness | (0.012*0.017mm) | |
Silkscreen | Color | white,black,yellow,blue… |
Min size | 0.006″(0.15mm) | |
Max Size of Finish Board | 700*460mm | |
Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
PCB Outline | Square,circle,irregular(with jigs) | |
Package | QFN,BGA,SSOP,PLCC,LGA |
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