Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment

Brand Name:Winsmart
Certification:CE
Model Number:SMTS32
Minimum Order Quantity:1 set
Delivery Time:5-8 days
Payment Terms:L/C, T/T, Western Union
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Verified Supplier
Location: Huizhou Guangdong China
Address: Liwu Industrial Park, Yuanzhou Town, Boluo County, Huizhou City, Guangdong Provice, China.
Supplier`s last login times: within 25 hours
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Product Details

SMT Assembly Equipment PCB Bonding Machine PCB Soldering Machine


PCB Bonding Machine Applicable Area:

LCD Module, Solar Battery, Camera , Electronic Components, Coil / Inductor, Mobile Devices, PWB, Power Devices.

All where there need to be heated or fusing or joining or forming.


PCB Bonding Machine Features:

1. Unique pulse heat technology provides fastest soldering head heating.

2. Programmable soldering temperature, heat-up rate and time duration for a wide range of products.

3. Thermocouple is fixed in close proximity to the working surface & the thermode, thus providing accurate temperature feedback control.

4. Closed Loop PID temperature control with clearly visible LED display.

5. Soldering time can be programmable and is triggered by temperature.

6. Floating thermode ensures consistent pressure and heat transfer between the thermode head and the parts to be joined.

7. Programmable pressure switch with LCD display for precise force control.

8. CCD camera system with magnification lens can be retrofitted for fine-pitch positioning.


PCB Bonding Machine Specification:


Machine size610×410×450mm
Working areaMax 150*150mm
Machine weight62Kg
Working air pressure0.6-0.8Mpa
Fixture quantity2
Thermode head sizeMax 40*3mm
Welding precisionpitch 0.2mm
Pressing time1~99.9s
Temperature settingsRT~500℃ tolerance ±5℃
Welding pressure1~20Kg
Temperature settingsTwo
Working environment10-60℃,40%-95%
Power supplyAC220V±10% 50HZ,2200W
Alignment modeCCD + LCD Monitor
Feeding modeManual
Starting modePress start button
Rotation PlatformCylinder control,tolerance<0.02mm

Customers' Applications:


Heat Bonding Paratmeter:

Temperature range50℃ to 500℃
Temperature accuracy±1°C
Bond timer0-12 seconds
Bond air pressure0.4-0.6MPa
Pressure accuracy±0.05MPa
Max bond force1100N

Our Advantages:

Our machine is completed with fine finishing in accordance with the quality standards of the industry.
Our strict quality management system maintains the excellent performance and quality of our products.
The product is the preferred one in the fields for its huge economic benefits.


Delivery Terms:

1. Ex-work/FOB/CIF/DDU, up to clients

2. Production leadtime: 7-15 days to customized make fixtures/jigs and test it with the punching machine.


China Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment supplier

Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment

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