EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material

eMMC IC package substrate pcb

For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics.

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally,
the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC
components. It is one of the most key materials of the IC packaging, and the share of IC substrate.

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC substrate,IC assembly,Storage IC substrage;

Spec.of pcb production:

Mini.Line space/width:1mil (25um)

Finished thickness:FR4 (0.1-0.4mm) finished thickness;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

Short introduction of Horexs Manufacturer:

HOREXS is whole process ultra thin FR4 PCB manufacturer in CHINA,It's also one of the famous thin FR4 PCB (IC Susbtrate ) manufacturers in CHINA,which has AVI,AOI for checking,3 LDI for soldermask and circuit line,Mekki brand laminate press machines,Quality yield more than 99.7%,quite Stable quality guaratnee! Welcome to visit us to check it too!

Almost of Horexs production machines are from Japan,high precision for production,It's also the reason of stable quality guarantee!

Welcome contact Horexs to produce your design/your idea/your pcb boards ,your layout desing.

When you send inquiry us,Pls be know that we have to get the following :

1-PCB production sepc. information;

2-Gerber files(PCB designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-For multilayer thin FR4 PCB,please also provide us layer stack-up information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality pcb ? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

HOREXS Group was located in CHINA mainland,has three subsidiaries:Boluo HongRuiXing Electronics Co., Ltd(Located in Huizhou city GuangDong),HongRuiXing (HuBei) Electronics Co.,Ltd(Located in HuBei province),Horexs Electronics (HK) Co.,Ltd(Located in HK),All are just located in difference place to meet our customers demand of ic substrate manufacture.Horexs supplies different kinds of IC substrate products. High quality and favorable price. We're pleased to get your Inquiry and we will come back to as soon as possible. We stick to the principle of "quality first, service first, continuous improvement and innovation to meet the customers" for the management and "zero defect, zero complaints" as the quality objective. To perfect our service, we provide the products with good quality at the reasonable price.

HOREXS Huizhou Built in 2009

Capacity 15000sqm/Month,Tenting process,BT materials,L/S 35/35um,

Mainly memory(BGA) substrates,parts of MEMS/CMOS/MiniLED/Sip/FCCSP package substrates and others ultra thin substrate.

HOREXS Hubei Built in 2020

HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memory IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

Horexs is a professional advanced semiconductors electronics packaging material manufacturer of semiconductor packaging substrate; Horexs's Products are widely used in IC assembly&Semiconductor package(Sip/CSP/FCCSP/PBGA/LGA/FBGA/MEMS/CMOS/RF Module etc).Such as Micro SD substrate,Sensor substrate,FCCSP package substrate,Fingerprint card substrate and other ultra thin substrate.

Horexs was founded in 2010, a total investment of ten million yuan, now has more than 20 professional technical personnel, engineering management and technical personnel more than 100 be trained with regularity, the monthly production capacity of 3000 square meters, plant a total area of 10000 square meters, including printing, electronic measurement, testing workshop dust-free workshop according to the construction of high standard; In order to meet the needs of high precision circuit board configuration Hitachi high-speed drilling machine, automatic electroplating production line, printing, exposure, development, etching, laminated, gold, gold, high standard NC a full set of production equipment; To ensure that the product qualified rate one hundred percent, electrical measuring machine, flying probe test, testing equipment for physical or chemical analysis room; Set up sewage treatment station and environmental protection exhaust gas treatment system, the heavy metals by ion exchange of organic waste water, complex, activated carbon filtration, chemical precipitation method to realize effective treatment discharge standards and a series of advanced technology.

Horexs adhere to high quality products, fast delivery, perfect service, good reputation, flexible marketing as the foundation of the market competition; To win in the Pearl River Delta and overseas customers trust and support. Also look forward to working with our new customer cooperation, achieve a win-win situation, create a better future!