0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing

Brand Name:XUANCAI
Certification:CE ROHS LM-80
Model Number:365 UV LED
Minimum Order Quantity:100 PCS
Delivery Time:4-7 days
Payment Terms:T/T, Western Union, Paypal , Alibaba trade assurance
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Verified Supplier
Location: Shenzhen Guangdong China
Address: 3/F, F Building, Maoyuan Industrial Area, Guanlan Longhua New Zone, Shenzhen, Guangdong, China
Supplier`s last login times: within 10 hours
Product Details Company Profile
Product Details

UV 365 LED Chip Korea LG Chip Good Quality 45*45 3 Years' Warranty 1600-2000mW CE ROHS For 3D Printing/ Ink Curing


Applications

ultraviolet disinfection/ uv curing/ UV Ink Curing/ Printing/ Moth-killing lamp/ l Medical treatment and health/ General use


Product Parameters


Product Information
Item
3W SMD LED
Size
35*35
Current
700mA
Voltage
3.2-3.8V
Wavelength
365-370nm
Chip Brand
LG
Quantity/ Reel
1000pcs
Warranty
Spanlife

3 Years
50000 hours

Features

1. Size(mm): 3.45×3.45×1.95         

2. Ceramic and silicone molding package    

3. Suitable for all SMT assembly and solder process    

4. Wide viewing angle: 120°            

5. Pb-free reflow soldering application         

6. RoHS compliant 


Package Dimensions


Typical Optical/ Electrical Characteristics @Ta=25

Symbol

Item

Min.

Typ.

Max.

Units

Test Conditions


IeRadiant intensitymW/srIF=700mA
ΦeRadiation Power12001500mwIF=700mA
VFForward Voltage3.23.8vIF=700mA
λdWave lengthnmIF=700mA
λpPeakWavelength365370nmIF=700mA
20-1/250% power angle120degIF=700mA
IRReverse Current20uAVR = 5V

Electro-Optical Characteristics (Ta=25℃)

Item

Symbol


Absolute Maximum Rating


Units

Power dissipationPd

3

W
DC Forward CurrentIF700mA
Peak Forward CurrentIFp800mA
Reverse VoltageVR5V
Operating TemperatureTopr-20 ~ +85 ℃
Storage TemperatureTstg-40 ~ +100 ℃
Junction TemperatureTj100°C

Tapping specifications (Units: mm)

Tape Dimensions: Loaded Quantity 1000pcs per reel



Application




Precautions for use :


Soldering

SMD LED encapsulation gumwater is flexible, and external force easily damages radiant surface and plastic shell.So when soldering , Please handle with care!

A. Reflow soldering shall be not more than two times and is suggested to be taken under reflow curve conditions with No-clean Flux, .The radiant surface shall be clean and unclean surface may influence the emitting color.

B. Manual soldering is only used for reparing. Anti-static iron (25W) is recommended and tweezer or iron should not touch the radiant surface and plastic parts. The soldering time should be not more than 3 seconds.

C. Don’t twist LED in course of manual soldering and testing, which may cause LED failure.

D. Please select the LED devices in the same BIN on the same PCB, otherwise may cause chromatic aberration.


Cleaning

A . Ultrasonic cleaning is not allowed. We recommend isopropyl alcohol or pure alcohol to for cleaning or dipping within 1 minute and reuse after 15 minutes in room temperature. LThe radiant surface shall be clean after cleaning and other wisemayh influence radiant color.

B. Isoamyl acetate, trichloroethylene, acetone, sulfide, nitride, acid, alkali and salt shall be avoided from LED, which may cause damage to LED.


Encapsulation

A . Encapsulation glue containing sodium ion or sulfide shall be avoided, which may cause fading fluorescence powder (poisoning).

B . When using normal encapsulation glue, trial testing is recommended for 168-hour operation before mass production.


Storage

A. The LED should be stored at 30℃ or less and 60%RH or less before opening the package. The storage shall not be over half a year.

B. After opening the package, the LEDs should be kept at 30-35%RH or less, and should be used within 3 days.

C. When temperature card shows 20% above after package opened, baking treatment shall be conducted before use(for reel package,: baking at 60±3℃ for 12 hrs; for bulk goods, baking at 120±5℃ for 4 hrs)

D. Acid, alkali and corrosive gas should be avoided in storage environment and intensively shock and high magnetic field also avoided.


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China 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing supplier

0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing

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