Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP

Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-069.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)


Today we talk about a type of 4 layer high frequency PCB. This PCB is built on 2 sheets of 0.813mm (32mil) RO4003C cores with 1 sheet RO4450F prepreg for the application of ultrahigh frequency coupler. Following is the stack-up.



In general, multilayer Rogers high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive. As is known to all, there’re 6 cores in RO4003C family, i.e. 8mil (0.203mm) to 60mil (1.524mm).


RO4003C:
8mil0.203mm
12mil0.305mm
16mil0.406mm
20mil0.508mm
32mil0.813mm
60mil1.524mm

Appendix: Properties of RO4003C

RO4003C Typical Value
PropertyRO4003CDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.38±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0027
0.0021
Z10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+40Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength139(20.2)
100(14.5)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength276
(40)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability<0.3X,Ymm/m
(mil/inch)
after etch+E2/150℃IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion11
14
46
X
Y
Z
ppm/℃-55℃to288℃IPC-TM-650 2.4.41
Tg>280℃ TMAAIPC-TM-650 2.4.24.3
Td425℃ TGAASTM D 3850
Thermal Conductivity0.71W/M/oK80℃ASTM C518
Moisture Absorption0.06%48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density1.79gm/cm323℃ASTM D 792
Copper Peel Stength1.05
(6.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
FlammabilityN/AUL 94
Lead-free Process CompatibleYes

The specifications of the board are as follows:

Base material: RO4003C 32mil + RO4450F 12mil PP

Layer count: 4 layers

Type: Castellation holes (half holes) on edge

Format: 113mm x 80mm = 1 type = 4 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 35 μm

Solder mask / Legend: no / no

Final PCB height: 2.1 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months


You enjoy the features and benefits

1) Excellent high frequency performance due to low dielectric tolerance and loss;

2) AOI inspection;

3) Meeting your PCB needs from prototype to mass production;

4) 30000 square meter month capability;

5) 8000 types of PCB's per month;

6) More than 16 years of PCB experience;


The Applications are

(1) GPS antenna

(2) WiFi amplifier

(3) Power amplifier

(4) RF transceiver

(5) TV antenna

(6) Radar data acquisition converter

(8) Spread spectrum, Attenuator



China Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP supplier

Immersion gold UL 94 Multi Layer PCB RO4003C 32mil And RO4450F 12mil PP

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