4 Layer 0.4mm FR4 PCB Board with Immersion Silver For Security Systems
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-469.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Product Details
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Product Details
Immersion Silver PCB on 0.4mm FR-4 ITEQ 4 Layer Circuit Board for
Security Systems
1.1 General description
This is a type of 4 layer printed circuit board built on FR-4
substrate with mid-Tg 150°C for the application of Security
Systems. It's only 0.4 mm thick with white silkscreen(Taiyo) on
green solder mask (Nanya) and immersion silver on pads. The base
material is from Taiwan ITEQ supplying 1 up PCB per panel. They're
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 30
boards are packed for shipment.
1.2 Features and benifits
Very Low Moisure Absorption and better CAF resistance
Good solderability
16000 square meter workshop
Meeting your PCB needs from prototype to mass production.
UL recognized and RoHS Directive-compliant
Customer complaint rate: <1%
1.3 Applications
Medium Access Control
Speaker System
Broadband Modem
Vfd Drive
Module GSM
Gate Access Control
1.4 Parameter and data sheet
| PCB SIZE | 111 x 45mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 4 Layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| PP 2116 x 1 | |
| copper ------- 18um(0.5oz) | |
| FR-4 0.1mm | |
| copper ------- 18um(0.5oz) | |
| PP 2116 x 1 | |
| copper ------- 18um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6.99mil/8.47mil |
| Minimum / Maximum Holes: | 0.399mm/3.556mm |
| Number of Different Holes: | 7 |
| Number of Drill Holes: | 1521 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-158, Tg>150 °C |
| Final foil external: | 1oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 0.5mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Silver, Ag>0.15µm |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.5 ITEQ Laminate/ Prepreg : IT-140TC / IT-140BS
| Property | Thickness<0.50 mm | Thickness≧0.50 mm | Units | Test Method | ||
| [0.0197 in] | [0.0197 in] | |||||
| Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
| (English) | (or as noted) | |||||
| Peel Strength, minimum | N/mm | 2.4.8 | ||||
| A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | (lb/inch) | 2.4.8.2 | ||||
| B. Standard profile copper foil | 0.96 (5.5) | 0.70 (4.0) | 0.96 (5.5) | 0.70 (4.0) | 2.4.8.3 | |
| 1. After Thermal Stress | ||||||
| 2. At 125°C [257 F] | ||||||
| 3. After Process Solutions | 1.75 (10 ) | 0.80 (4.57) | 1.93 (11.0) | 1.05 (6.00) | ||
| 1.66 (9.5) | 0.70 (4.00) | 1.66 (9.5) | 0.70 (4.00) | |||
| 1.49 (8.5) | 0.55 (3.14) | 1.49 (8.5) | 0.80 (4.57) | |||
| Volume Resistivity, minimum | MW-cm | 2.5.17.1 | ||||
| A. C-96/35/90 | 5x1010 | 106 | -- | -- | ||
| B. After moisture resistance | -- | -- | 5x1010 | 104 | ||
| C. At elevated temperature E-24/125 | 5x1010 | 103 | 5x1010 | 103 | ||
| Surface Resistivity, minimum | MW | 2.5.17.1 | ||||
| A. C-96/35/90 | 3.5x1010 | 104 | -- | -- | ||
| B. After moisture resistance | -- | -- | 3.5x1010 | 104 | ||
| C. At elevated temperature E-24/125 | 6x1010 | 103 | 6x1010 | 103 | ||
| Moisture Absorption, maximum | 0.3 | -- | 0.1 | 0.8 | % | 2.6.2.1 |
| Dielectric Breakdown, minimum | -- | -- | 60 | 40 | kV | 2.5.6 |
| Permittivity (Dk, 50% resin content) | 4.6 | 5.4 | 4.6 | 5.4 | -- | 2.5.5.9 |
| (Laminate & Laminated Prepreg) | ||||||
| A. 1MHz | ||||||
| Loss Tangent (Df, 50% resin content) | 0.016 | 0.035 | 0.016 | 0.035 | -- | 2.5.5.9 |
| (Laminate & Laminated Prepreg) | ||||||
| A. 1MHz | ||||||
| Flexural Strength, minimum | N/mm2 | 2.4.4 | ||||
| A. Length direction | -- | -- | 500-530 | 415 | (lb/in2) | |
| -- | -- | (72,500-76,850) | -60,190 | |||
| B. Cross direction | -- | -- | 430-460 | 345 | ||
| -- | -- | (62,350-66,700) | -50,140 | |||
| Arc Resistance, minimum | 120 | 60 | 120 | 60 | s | 2.5.1 |
| Thermal Stress 10 s at 288°C [550.4F],minimum | Rating | 2.4.13.1 | ||||
| A. Unetched | Pass | Pass Visual | Pass | Pass Visual | ||
| B. Etched | Pass | Pass Visual | Pass | Pass Visual | ||
| Electric Strength, minimum | 45 | 30 | -- | -- | kV/mm | 2.5.6.2 |
| (Laminate & Laminated Prepreg) | ||||||
| Flammability, | V-0 | V-0 | V-0 | V-0 | Rating | UL94 |
| (Laminate & Laminated Prepreg) | ||||||
| Glass Transition Temperature(DSC) | 140 | 135 minimum | 140 | 135 minimum | ˚C | 2.4.25 |
| Decomposition Temperature | -- | -- | 305 | -- | ˚C | 2.4.24.6 |
| (5% wt loss) | ||||||
| Z-Axis CTE | 2.4.24 | |||||
| A. Alpha 1 | -- | -- | 55 | -- | ppm/˚C | |
| B. Alpha 2 | -- | -- | 290 | -- | ppm/˚C | |
| C. 50 to 260 Degrees C | -- | -- | 4.2 | -- | % | |
| Thermal Resistance | 2.4.24.1 | |||||
| A. T260 | -- | -- | 15 | -- | Minutes | |
| B. T288 | -- | -- | 2 | -- | Minutes | |
| CAF Resistance | -- | -- | Pass | AABUS | Pass/Fail | 2.6.25 |
4 Layer 0.4mm FR4 PCB Board with Immersion Silver For Security Systems
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