High Temperature 8 Layer FR4 PCB Board For Satellite Radio
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-479.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Product Details
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Product Details
Via in Pad PCB High Temperature VIP PCB 8-Layer Circuit Board on
FR-4 with Immersion Gold for Satellite Radio
1.1 General description
This is a type of 8 layer printed circuit board built on FR-4 Tg170
substrate for the application of Satellite Radio. It's 1.6 mm thick
with white silkscreen(Taiyo) on green solder mask (Taiyo) and
immersion gold on pads. The base material is from Taiwan ITEQ
supplying 1 up PCB per panel. Vias with 0.2mm are resin filled and
capped (via in pad). They're fabricated per IPC 6012 Class 2 using
supplied Gerber data. Each 25 panels are packed for shipment.
1.2 Features and benefits
(1) RoHS compliant and suitable for high thermal reliability needs
(2) High solderability, no stressing of circuit boards and less
contamination of PCB surface.
(3) Delivery on time. Higher than 98% on-time-delivery rate.
(4) 30000 square meter month capability
(5) More than 15 years of experience
(6) Volume Production capability
1.3 Applications
(1) Satellite Communication
(2) Solar Panel Inverter
(3) Embedded Processor
1.4 Parameter and data sheet
| PCB SIZE | 215 x 212mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 8 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Prepreg 7628(43%) 0.195mm | |
| copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 2 | |
| Prepreg 7628(43%) 0.195mm | |
| copper ------- 35um(1oz) MidLayer 3 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 4 | |
| Prepreg 7628(43%) 0.195mm | |
| copper ------- 35um(1oz) MidLayer 5 | |
| FR-4 0.2mm | |
| copper ------- 35um(1oz) MidLayer 6 | |
| Prepreg 7628(43%) 0.195mm | |
| copper ------- 18um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.3/3.2mm |
| Number of Different Holes: | 18 |
| Number of Drill Holes: | 11584 |
| Number of Milled Slots: | 2 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 TG170℃, er<5.4.IT-180, ITEQ Supplied |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (32.1% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000 KX700G, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, stamp holes. |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.5 Design For Manufacture (3)
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume (S<100 m²) | Middle volume (S<10 m²) | Prototype(S<1m²) | |||
| 31 | Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Maximum via-plug diameter | 0.5mm | 0.5mm | 0.5mm |
| 32 | Min.width of solder mask bridge | Green:5mil(35um) | Green:4mil(35um) | Green:4mil(35um) | |
| 33 | Yellow:5mil(35um) | Yellow:4mil(35um) | Yellow:4mil(35um) | ||
| 34 | Blue:5mil(35um) | Blue:4mil(35um) | Blue:4mil(35um) | ||
| 35 | Black:6mil(35um) | Black:6mil(35um) | Black:6mil(35um) | ||
| 36 | White:6mil(35um) | White:6mil(35um) | White:6mil(35um) | ||
| 37 | All of Matt:6mil | All of Matt:6mil | All of Matt:6mil | ||
| 38 | Green:5mil(70um) | Green:4mil(70um) | Green:4mil(70um) | ||
| 39 | Yellow:5mil(70um) | Yellow:4mil(70um) | Yellow:4mil(70um) | ||
| 40 | Blue:5mil(70um) | Blue:4mil(70um) | Blue:4mil(70um) | ||
| 41 | Black:6mil(70um) | Black:6mil(70um) | Black:6mil(70um) | ||
| 42 | White:6mil(70um) | White:6mil(70um) | White:6mil(70um) | ||
| 43 | Open solder mask | 4mil(35um) | 4mil(35um) | 3mil(35um) | |
| 44 | Solder mask coverage | 4mil(35um) | 4mil(35um) | 3mil(35um) | |
| 45 | Min.width of solder mask text | 9mil(35um) | 9mil(35um) | 8mil(35um) | |
| 46 | Min.thickness of Solder mask | 9um(35um) | 9um(35um) | 9um(35um) | |
| 47 | Max.thickness of solder mask | 30um(35um) | 30um(35um) | 30um(35um) | |
High Temperature 8 Layer FR4 PCB Board For Satellite Radio
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