UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-956.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Verified Supplier
Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Supplier`s last login times:
within 1 hours
Product Details
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Product Details
SMT PCB Assembly Solder Paste Stencil | PCB Stencil Laser Cut
1.1 General description
This is a type of solder paste SMT stencil (100% laser cut) built
on 0.1mm stainless steel foil with aluminum frame 420 mm x 520 mm x
20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber
data, squeegee area locating in the center. Fiducal marks are
through holes to suit for the SMT machine. It’s packed with KK
carton (hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
The data file is used directly to produce and reduce the error
rate;
The opening position accuracy of SMT template is very high: the
whole process error is ≤ ±4 μ m;
The opening of SMT template has geometric figure, which is
advantageous to the printing and forming of tin paste;
Engineering design prevents problems from occurring in pre
production;
Team with passion, discipline, responsibility and honesty;
Door to door shipment service;
More than 15 years of experience;
Hassle-free, one-to-one after-sales service;
1.3 Applications
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
| Dimension: | 370mm x 470mm, 420mm x 520mm, 550mm x 650mm | |||||
| Structure | Stencil foils with aluminum frame | |||||
| Base material | Stainless steel shim | |||||
| Foil Thickness | 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm | |||||
| Aperture configured | Laser cut | |||||
| Appearance | Engraving and electro polishing | |||||
| Fiducial mark | Through hole | |||||
| Service area: | Worldwide | |||||
| Quantity of open pads: | 1421 | |||||
| Advantages: | a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. | |||||
| Application: | CSP, BGA, 0.5mm QFP etc. package | |||||
1.5 Opening Holes Design for SMT Stencil
| Component Type | Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
| PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
| QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
| QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
| QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
| QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
| 0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
| 0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
| BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
| BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
| BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
| Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
| Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |
UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil
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