Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-957.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Product Details
SMT Stencil For PCB Assembly Solder Paste Laser Profile
1.1 General description
This is a type of solder paste SMT stencil (100% laser cut) built
on 0.1mm stainless steel foil with aluminum frame 420 mm x 520 mm x
20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber
data, squeegee area locating in the center. Fiducal marks are
through holes to suit for the SMT machine. It’s packed with KK
carton (hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
The data file is used directly to produce and reduce the error
rate;
The opening position accuracy of SMT template is very high: the
whole process error is ≤ ±4 μ m;
The opening of SMT template has geometric figure, which is
advantageous to the printing and forming of tin paste;
Engineering design prevents problems from occurring in pre
production;
Money-saving, Worry-saving and Labor-saving;
Door to door shipment service;
More than 9000 types per month;
No minimum order quantity. 1 piece is available;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
| Dimension: | 370mm x 470mm, 420mm x 520mm, 550mm x 650mm | |||||
| Structure | Stencil foils with aluminum frame | |||||
| Base material | Stainless steel shim | |||||
| Foil Thickness | 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm | |||||
| Aperture configured | Laser cut | |||||
| Appearance | Engraving and electro polishing | |||||
| Fiducial mark | Through hole | |||||
| Service area: | Worldwide | |||||
| Quantity of open pads: | 1533 | |||||
| Advantages: | a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. | |||||
| Application: | CSP, BGA, 0.5mm QFP etc. package | |||||
1.5 Opening Holes Designs for SMT Stencil
| Component Type | Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
| PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
| QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
| QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
| QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
| QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
| 0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
| 0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
| BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
| BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
| BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
| Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
| Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |
Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil
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