Kappa 438 Rogers Microwave Ceramic Circuit Board 60mil For Wireless Meters

Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-165.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Location: Shenzhen Guangdong China
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Product Details

Rogers Microwave PCB Built on Kappa 438 60mil 1.524mm DK 4.38 with Immersion Gold for Wireless Meters

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.


Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.


Features

1. Glass reinforced hydrocarbon thermoset platform

2. Dk of 4.38 is tailored to FR-4 industry standard norms

3. Tighter Dk and thickness tolerance than FR-4

4. Low Z Axis CTE of 42 ppm/°C

5. High Tg of > 280°C TMA

6. Meets UL 94-V0 requirements



Benefits

1. Ease of PCB manufacturing and assembly in Line with FR-4

2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance

3. Consistent circuit performance

4. Improved design flexibility and plated through-hole reliability

5. Automated assembly compatible


Typical Applications:

1. Carrier Grade WiFi/Licensed Assisted Access (LAA)

2. Small Cell and Distributed Antenna Systems (DAS)

3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)

4. Internet of Things (IoT)

Segments: Smart Home and Wireless Meters




Our PCB Capability (Kappa 438)

PCB Material:Glass Reinforced Hydrocarbon Ceramic
Designation:Kappa 438
Dielectric constant:4.38
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm)
PCB thickness:20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

Data Sheet of Kappa 438 Laminate

PropertyTypical Value Kappa 438DirectionUnitsConditionTest Method
Dielectric Constant, er Design4.38Z-2.5 GHzDifferential Phase Length Method
Dissipation Factor tan, d0.005Z-10 GHz/23°CIPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant e-21-ppm/°C10 GHz (-50 to 150°C)Modified IPC-TM-650 2.5.5.5
Volume Resistivity2.9 x 109-MΩ•cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity6.2 x 107-MΩCOND AIPC-TM-650 2.5.17.1
Electrical Strength675ZV/mil-IPC-TM-650 2.5.6.2
Tensile Strength16 12MD CMDkpsi-ASTM D3039/D3039-14
Flexural Strength25 19MD CMDkpsi-IPC-TM-650 2.4.4
Dimensional Stability-0.48-0.59MD CMDmm/m-IPC-TM-650 2.4.39a
Coefficient of Thermal Expansion13Xppm/°C-55 to 288°CIPC-TM-650 2.4.41
16Y
42Z
Thermal Conductivity0.64ZW/(m.K)80°CASTM D5470
Time to Delamination (T288)>60-minutes288°CIPC-TM-650 2.4.24.1
Tg>280-°C TMA-IPC-TM-650 2.4.24.3
Td414-°C-IPC-TM-650 2.3.40
Moisture Absorption0.07-%24/23IPC-TM-650 2.6.2.1
Young’s Modulus2264 2098MD CMDkpsi-ASTM D3039/D3039-14
Flex Modulus2337 2123MD CMDkpsi-IPC-TM-650 2.4.4
Bow0.03-%-IPC-TM-650 2.4.22C
Twist0.08-%-IPC-TM-650 2.4.22C
Copper Peel Strength After Thermal Stress5.8-lbs/in1 oz (35 µm) foilIPC-TM-650 2.4.8
FlammabilityV-0---UL 94
Specific Gravity1.99-g/cm3-ASTM D792
Lead-Free Process CompatibleYes---


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Kappa 438 Rogers Microwave Ceramic Circuit Board 60mil For Wireless Meters

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