Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance

Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-500.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Location: Shenzhen Guangdong China
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.



Key Features

1. Excellent electrical properties

2. Dielectric constant less than 3.5

3. Dissipation factor less than 0.010

4. Excellent, stable and flat Dk/Df performance

5. Compatible with most FR-4 processes

6. Lead free process compatible

7. Improved z-axis thermal expansion

8. Anti-CAF capability

9. Superior dimensional stability, thickness uniformity and flatness

10. Excellent through-hole and soldering reliability


Our PCB Capabilities (TU-872 SLK Sp)

PCB Material:High performance modified epoxy FR-4 resin
Designation:TU-872 SLK Sp
Dielectric constant:< 3.5
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness:10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology:HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

Main Applications

1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers


Our Advantages

ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

16000㎡ workshop;

30000㎡ output capability per month;

Prototype to large volume production capability

IPC Class 2 / IPC Class 3;

Any layer HDI PCBs;

Delivery on time: >98%

Customer complaint rate: <1%


Typical Properties (TU-872 SLK Sp)

Typical ValuesConditioningIPC-4101 /126
Thermal
Tg (DMA)220°C
Tg (DSC)200°C> 170°C
Tg (TMA)190°CE-2/105
Td (TGA)340°C> 340°C
CTE x-axis12~15 ppm/°CN/A
CTE y-axis12~15 ppm/°CE-2/105N/A
CTE z-axis2.30%< 3.0%
Thermal Stress,Solder Float, 288°C> 60 secA> 10 sec
T26060 min> 30 min
T28820 minE-2/105> 15 min
T3005 min> 2 min
Flammability94V-0E-24/12594V-0
DK & DF
Permittivity (RC 50%) @10GHz3.5
Loss Tangent (RC 50%) @10GHz0.008
Electrical
Permittivity (RC50%)
1GHz (SPC method/4291B)3.6/3.4< 5.2
5GHz (SPC method)3.5E-2/105-
10GHz (SPC method)3.5-
Loss Tangent (RC50%)
1GHz (SPC method/4291B)0.006/0.004
5GHz (SPC method)0.007E-2/105< 0.035
10GHz (SPC method)0.008
Volume Resistivity> 1010 MΩ•cmC-96/35/90> 106 MΩ•cm
Surface Resistivity> 108 MΩC-96/35/90> 104 MΩ
Electric Strength> 40 KV/mmA> 30 kV/mm
Dielectric Breakdown> 50 kVAN/A
Mechanical
Young’s Modulus
Warp Direction26 GPaAN/A
Fill Direction24 GPa
Flexural Strength
Lengthwise> 60,000 psiA> 60,000 psi
Crosswise> 50,000 psiA> 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil4~7 lb/inA> 4 lb/in
Water Absorption0.13%E-1/105+D-24/23< 0.5 %


China Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance supplier

Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance

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