10mil Rogers RT/Duroid 6010.2LM Ceramic PTFE Composite PCB With Immersion Gold
Contact Now
Add to Cart
Verified Supplier
Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
We are pleased to present our latest product, the newly shipped Rogers RT/duroid 6010.2LM Ceramic-PTFE Composite PCB. Designed with advanced materials and exceptional manufacturing techniques, this PCB ensures high performance and reliability for a wide range of applications. Let's explore its impressive features and specifications:
1. PCB Material:
- The PCB is constructed using Rogers RT/duroid 6010.2LM
ceramic-PTFE composites, known for their superior electrical
properties and thermal stability.
- The process dielectric constant (DK) is 10.2 at 10 GHz and 23°C,
ensuring precise signal transmission and minimal signal loss.
- With a low dissipation factor of 0.0023 at 10 GHz and 23°C, this
PCB minimizes energy loss and maintains signal integrity.
- The PCB material has a high decomposition temperature (Td) of
500°C, ensuring excellent thermal resistance.
- The operating temperature range extends from -40℃ to +85℃, making
it suitable for a wide range of environmental conditions.
2. Stackup: 2-Layer Rigid PCB
- The PCB features a 2-layer rigid construction, providing a
compact and efficient design solution.
- Copper_layer_1 has a thickness of 35 μm.
- The substrate (RT/duroid 6010.2LM) has a thickness of 0.254 mm
(10mil), offering stability and durability.
- Copper_layer_2 has a thickness of 35 μm, ensuring excellent
conductivity.
3. Construction Details:
- The board dimensions are 156.76mm x 86.79mm, available in 4
types, with a tolerance of +/- 0.15mm, guaranteeing precise
dimensions.
- The PCB supports a minimum trace/space of 4/4 mils, enabling
intricate circuit designs.
- The minimum hole size is 0.4mm, facilitating precise component
placement.
- There are no blind vias, simplifying the manufacturing process.
- The finished board thickness is 0.37mm, providing a compact and
lightweight solution.
- The outer layers have a finished copper weight of 1oz (1.4 mils),
ensuring optimal conductivity.
- Via plating thickness is 20 μm, promoting reliable connections.
- The surface finish is immersion gold, offering excellent
corrosion resistance and solderability.
- Top and bottom silkscreen are not included, providing a clean and
minimalist appearance.
- The top solder mask is green, providing protection and enhancing
visibility.
- The bottom solder mask is also green, ensuring consistency and
durability.
- All PCBs undergo a 100% electrical test prior to shipment,
guaranteeing functionality and reliability.
4. PCB Statistics:
- The PCB supports a total of 97 components, providing ample space
for various circuit configurations.
- There are 183 pads in total, including 108 thru-hole pads, 63 top
SMT pads, and 12 bottom SMT pads.
- The PCB includes 115 vias, ensuring efficient signal routing.
- With 7 nets available, this PCB accommodates complex circuit
connections.
5. Artwork and Standards:
- The PCB artwork is supplied in Gerber RS-274-X format, ensuring
compatibility with industry-standard design tools.
- The PCB meets the IPC-Class-2 standard, ensuring high-quality
manufacturing and reliability.
6. Availability:
- Our newly shipped PCBs are available worldwide, catering to
customers globally.
7. Contact Information:
- For any technical questions or inquiries, please contact Ivy at
sales10@bichengpcb.com. Our dedicated team is ready to assist you.
| Dielectric Constant,εProcess | 10.2±0.25 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
| Dielectric Constant,εDesign | 10.7 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0023 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -425 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 105 | Mohm.cm | A | IPC 2.5.17.1 | |
| Surface Resistivity | 5 x 106 | Mohm | A | IPC 2.5.17.1 | |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
| Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A | |
| Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A | |
| Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A | |
| Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
| Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A | |
| Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A | |
| Ultimate Strain | 25 | Z | % | ||
| Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A | |
| Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.01 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
| Thermal Conductivity | 0.86 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion | 24 24 47 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ℃ TGA | ASTM D3850 | ||
| Density | 3.1 | g/cm3 | ASTM D792 | ||
| Specific Heat | 1.00(0.239) | j/g/k (BTU/ib/OF) | Calculated | ||
| Copper Peel | 12.3 (2.1) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Unleash the Potential of Ceramic-PTFE Composite PCBs: Introducing RT/duroid 6010LM
When it comes to high-performance PCBs, the choice of materials is crucial. We are thrilled to introduce our Ceramic-PTFE composite PCBs, featuring the renowned RT/duroid 6010LM designator. With exceptional dielectric properties and versatile options, these PCBs cater to diverse applications. Let's delve into the key features and specifications of these remarkable PCBs:
1. PCB Material: Ceramic-PTFE Composite
Our PCBs are constructed using a robust Ceramic-PTFE composite
material, specifically the RT/duroid 6010LM designator. This
composite offers excellent electrical characteristics and thermal
stability, making it ideal for demanding circuitry.
2. Dielectric Constant:
The dielectric constant of our Ceramic-PTFE composite PCBs is 10.2
± 0.25 in the manufacturing process. For design purposes, the
dielectric constant stands at 10.7, ensuring precise signal
transmission and minimizing signal loss.
3. Layer Count: 1 Layer, 2 Layer
Our PCBs are available in both 1-layer and 2-layer configurations,
providing flexibility for various design requirements. Whether you
need a simple single-layer design or a more complex double-layer
circuitry, our Ceramic-PTFE composite PCBs have got you covered.
4. Copper Weight:
We offer multiple options for copper weight, allowing you to tailor
the PCB to your specific needs. Choose from 0.5oz (17 μm), 1oz
(35μm), or 2oz (70μm) copper weight, depending on your desired
conductivity and power requirements.
| PCB Material: | Ceramic-PTFE composite |
| Designator: | RT/duroid 6010LM |
| Dielectric constant: | 10.2 ±0.25 (process); 10.7 (design) |
| Layer count: | 1 Layer, 2 Layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
5. Dielectric Thickness:
Our Ceramic-PTFE composite PCBs are available in various dielectric
thicknesses, accommodating different circuit designs. Choose from
10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), or 75mil (1.90mm)
dielectric thicknesses, enabling you to optimize the PCB for your
specific application.
6. PCB Size:
Our Ceramic-PTFE composite PCBs support a maximum size of ≤400mm X
500mm, offering ample space for your circuitry. Whether you need a
compact PCB or a larger one, we have the size options to fulfill
your requirements.
7. Solder Mask:
We provide a range of solder mask color options to suit your
aesthetic and functional preferences. Choose from classic Green,
sleek Black, vibrant Blue, vivid Yellow, or striking Red solder
masks. These options allow for easy identification and ensure
efficient assembly and soldering processes.
8. Surface Finish:
To meet diverse needs, we offer various surface finish options for
our Ceramic-PTFE composite PCBs:
- Bare copper: Ideal for specialized applications requiring direct
copper contact.
- HASL (Hot Air Solder Leveling): A cost-effective and widely used
surface finish.
- ENIG (Electroless Nickel Immersion Gold): Ensures excellent
solderability and corrosion resistance.
- Immersion tin: Provides a flat and even surface for soldering.
- Immersion silver: Offers superior conductivity and excellent
surface planarity.
- OSP (Organic Solderability Preservative): Provides a protective
layer for soldering and shelf life.
Our surface finish options cater to different assembly processes, environmental conditions, and budget considerations, ensuring the optimal solution for your PCB needs.
Experience the Power of Ceramic-PTFE Composite PCBs
With our Ceramic-PTFE composite PCBs featuring the RT/duroid 6010LM
designator, you can unlock the full potential of your electronic
designs. These PCBs offer exceptional dielectric properties,
versatility in layer count and copper weight, and a wide range of
size options. Customize your PCB with various solder mask colors
and select the ideal surface finish for your application. Trust in
the reliability and performance of our Ceramic-PTFE composite PCBs
to take your projects to new heights.
10mil Rogers RT/Duroid 6010.2LM Ceramic PTFE Composite PCB With Immersion Gold
Inquiry Cart
0