RT / Duroid 6010.2LM 2 Layer Pcb Board For Microwave Circuit Design
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
Place of Origin:CHINA
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Shenzhen Guangdong China
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Product Details
Introducing the RT/duroid 6010.2LM PCB, a high-performance solution specifically engineered for electronic and microwave circuit applications. Crafted from advanced ceramic-PTFE composites, this laminate offers a high dielectric constant, making it ideal for applications requiring significant circuit size reduction. Designed for low-loss performance, it excels in X-band operations and below, ensuring reliable and repeatable circuit performance.
What is RT/duroid 6010.2LM?
RT/duroid 6010.2LM is a sophisticated laminate material composed of
ceramic-PTFE composites. These materials are engineered to meet the
stringent requirements of high-frequency applications, where
traditional materials may fall short. The high dielectric constant
and low loss characteristics make this laminate particularly
suitable for applications operating at X-band frequencies and
below.
Key Characteristics
1. High Dielectric Constant (Dk):
The RT/duroid 6010.2LM boasts a Dk of 10.2 ± 0.25 at 10GHz. This
high dielectric constant enables significant circuit size
reduction, allowing for more compact designs without sacrificing
performance.
2. Low Loss:
With a dissipation factor of 0.0023 at 10GHz, this material
minimizes signal loss, making it ideal for high-frequency
applications. This property is crucial for maintaining signal
integrity in microwave communications.
3. Thermal Stability:
The laminate has a decomposition temperature (Td) of 500 °C,
indicating its ability to withstand high temperatures during
processing. This thermal stability, coupled with a low coefficient
of thermal expansion (CTE) of 24 ppm/°C in the x and y directions
and 47 ppm/°C in the z direction, ensures reliable performance in
varying environmental conditions.
4. Moisture Resistance:
With a moisture absorption rate of only 0.01%, the RT/duroid
6010.2LM effectively mitigates the risks associated with
moisture-related electrical losses, enhancing the reliability of
the circuits.
5. Flammability Rating:
The material meets the V-0 flammability rating per UL94, ensuring
safety in high-risk applications.
PCB Construction
| Property | RT/duroid 6010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.25 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
| Dielectric Constant,εDesign | 10.7 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0023 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -425 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 105 | Mohm.cm | A | IPC 2.5.17.1 | |
| Surface Resistivity | 5 x 106 | Mohm | A | IPC 2.5.17.1 | |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
| Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A | |
| Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A | |
| Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A | |
| Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
| Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A | |
| Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A | |
| Ultimate Strain | 25 | Z | % | ||
| Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A | |
| Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.01 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
| Thermal Conductivity | 0.86 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion | 24 24 47 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ℃ TGA | ASTM D3850 | ||
| Density | 3.1 | g/cm3 | ASTM D792 | ||
| Specific Heat | 1.00(0.239) | j/g/k (BTU/ib/OF) | Calculated | ||
| Copper Peel | 12.3 (2.1) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Stackup Design
This PCB is constructed with a 2-layer rigid design, which
includes:
Copper Layer 1: 35 μm
Core Material: Rogers RT/duroid 6010.2LM, measuring 0.254 mm (10
mil)
Copper Layer 2: 35 μm
Dimensions and Specifications
Board Dimensions: 46 mm x 54.3 mm, with a tolerance of ± 0.15 mm.
Minimum Trace/Space: 4/4 mils, allowing for precise routing of
signals.
Minimum Hole Size: 0.5 mm, accommodating various component types.
Finished Board Thickness: 0.3 mm, optimizing the board’s profile
for compact applications.
Finished Copper Weight: 1 oz (1.4 mils) for outer layers, balancing
conductivity and thermal dissipation.
Surface Finish and Quality Assurance
Surface Finish: Immersion Silver, providing excellent solderability
and protection against oxidation.
Silkscreen and Solder Mask: The top silkscreen is white, while the
top solder mask is green, facilitating easy identification of
components and connections. The bottom side has no silkscreen or
solder mask, reducing cost and complexity.
Electrical Testing: Each PCB undergoes 100% electrical testing prior to shipment, ensuring that every unit meets stringent quality standards.
Benefits of Using RT/duroid 6010.2LM PCB
1.Circuit Size Reduction:
The high dielectric constant allows for smaller circuit designs,
enabling more compact electronic devices.
2. Enhanced Performance:
Low loss characteristics ensure that signals remain strong,
reducing the need for additional amplifiers or signal conditioning.
3. Reliability in Multilayer Boards:
The low Z-axis expansion supports the integrity of plated through
holes, vital for multilayer applications.
4. Resilience to Environmental Factors:
Low moisture absorption and high thermal stability provide robust
performance in diverse operating conditions.
5. Consistency in Manufacturing:
Tight control over dielectric constant and thickness ensures
repeatable performance across production runs.
| PCB Material: | Ceramic-PTFE composite |
| Designator: | RT/duroid 6010LM |
| Dielectric constant: | 10.2 ±0.25 (process); 10.7 (design) |
| Layer count: | 1 Layer, 2 Layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
Typical Applications
The versatility of the RT/duroid 6010.2LM PCB allows it to be
employed in various high-tech applications, including:
Patch Antennas: Used in wireless communication devices for signal
transmission.
Satellite Communications Systems: Essential for reliable data
transmission in space applications.
Power Amplifiers: Critical components in RF applications, providing necessary amplification for signals.
Aircraft Collision Avoidance Systems: Vital for enhancing safety in aviation through effective signal processing.
Ground Radar Warning Systems: Employed in military and defense applications for threat detection.
Conclusion
The RT/duroid 6010.2LM PCB stands as a testament to the
advancements in PCB technology, addressing the growing demands for
high-frequency performance, reliability, and miniaturization in
electronic design. Its unique combination of features and benefits
make it an ideal choice for engineers and manufacturers looking to
innovate in the fields of telecommunications, aerospace, and
defense. By choosing the RT/duroid 6010.2LM PCB, you not only
invest in superior technology but also ensure the success of your
electronic applications in an increasingly competitive market.
RT / Duroid 6010.2LM 2 Layer Pcb Board For Microwave Circuit Design
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