Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field

Brand Name:SIGNI
Certification:ISO
Model Number:SS
Minimum Order Quantity:1PC
Delivery Time:15 DAYS
Payment Terms:D/A, D/P, T/T, Western Union, MoneyGram
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Address: NO. 439 JINGLIAN RD, SHNAGHAI,CHINA 201108
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Product Details

Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field

Product Features

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.


This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on the Japanese, Korean grinders with high performance.


Product Description

Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.


Material of workpiece: Synthetic sapphire, SiC, single crystal silicon.


Grinders: SHUWA, NTS, WEC, GALAXY, SPEEDFAM.


China Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field supplier

Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field

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