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With wide direct bandgap(3.4 eV), strong atomic bonds, high thermal conductivity and excellent radiation resistance, GaN is not only short-wave-length optoelectronic material, but also a well alternative material for high temperature semiconductor devices. Based on the stable physical and chemical properties, GaN is suitable for LED applications (blue, green, UV-light), ultraviolet detectors and optoelectronic high-power and high-frequency devices.
Specification | ||
Type | GaN-FS-10 | GaN-FS-15 |
Size | 10.0mm×10.5mm | 14.0mm×15.0mm |
Thickness | Rank 300, Rank 350, Rank 400 | 300 ± 25 µm, 350 ± 25 µm, 400 ± 25 µm |
Orientation | C-axis(0001) ± 0.5° | |
TTV | ≤15 µm | |
BOW | ≤20 µm | |
Carrier Concentration | >5x1017/cm3 | / |
Conduction Type | N-type | Semi-Insulating |
Resistivity(@300K) | < 0.5 Ω•cm | >106 Ω•cm |
Dislocation Density | Less than 5x106 cm-2 | |
Useable Surface Area | > 90% | |
Polishing | Front Surface: Ra < 0.2nm. Epi-ready polished Back Surface: Fine ground | |
Package | Packaged in a class 100 clean room environment, in single wafer containers, under a nitrogen atmosphere. |