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PCB Soldering SMT Reflow Oven
Product features:
1. All temperature zones are heated up and down separately;
independent hot air circulation, independent temperature control,
temperature control accuracy of each temperature zone ± 1 °C.
2. Modular heating structure, effectively preventing the influence
of airflow in the temperature range, ensuring uniform heating of
components, lateral temperature deviation <±2°C.
3. The upper furnace body is opened by pneumatic lifting, which is
safe and reliable for easy cleaning of the furnace.
4. Special long-life nickel-nickel heating wire type heat source,
with sufficient power and rapid heating, from room temperature to
constant temperature less than 20 minutes.
5. It adopts imported high-speed air motor direct drive to carry
out thermal cycle, low noise, low vibration and high thermal cycle
efficiency.
6. Adopt PLC industrial control product upper and lower machine
control, with first-class stability.
7. It has a double synchronous transmission system for rail chain
and mesh belt and a lubrication system.
8. The guide rail is made of special high-quality aluminum alloy
with high hardness and high strength, small deformation and high
precision.
9. With delay switch protection function to prevent deformation of
transmission parts due to uneven cooling.
10. It has power-off protection function to ensure normal output of
PCB board after power failure without damage.
11. With over temperature sound and light alarm and emergency
braking system.
12. Simplified and traditional Chinese MMI operation interface and
artificial intelligence software control, greatly facilitating
user's use
13. Complete online temperature test curve and analysis, storage,
recall and printing functions.
14. Dedicated temperature acquisition module with high precision
and fast speed, with cold junction compensation.
15. Double cooling zone design for lead-free process soldering.
16. With timed automatic shutdown function.
17. Flux recovery unit, no filter design, effectively extending the
furnace cleaning cycle.
Product parameters:
use solder paste type | Lead-free solder/ordinary solder |
Suitable for element types | BGA, CSP, single/double panel, etc |
Heating area | upper and down 8 heating zones, and 2 cooling zones |
Heating zone length | 3100 mm |
temperature control mode | PC + PLC control |
Temperature control precision | + / - 1 ℃ |
The temperature control range | room temperature to 350 ℃ |
PCB transverse temperature deviation | < ±2℃ |
The heating time | Approx 20 min |
transport transmission | network chain transmission + guide rail (Optional) |
Chain guide the wide range | from 20 to 300 mm |
Network belt width | 400 mm |
The transmission speed | 25 ~ 2000mm/min |
PCB transport direction | left to right (right to left) optional |
power supply | 3 phase , 380 v, 50 hz |
Start power | 32 kw |
Normal work power | 7 kw |
transport wind way | All hot air |
Net weight | 1600 kg |
The machine size | L4400*H1450*W900mm |