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50μm Rigid Flexible PCBs Manufacturer Flexible Printed Circuit Boards
Flex PCB and Rigid Flex PCB Manufacturer, Flexible Printed Circuit
Boards
Flexible PCB is mainly divided into single-sided flex PCB, hollow
FPCB board, double-sided Flex PCB, multi-layer flexible board, and
rigid-flexible PCB board.
FASTPCBA provide 1- 12 Layer Flexible PCB Manufacturing services
for both quick turn prototypes and production quantities. Flexible
circuit fabrication and assembly, Our Engineer provide free DFM
Checking.
Technical parameter
Number of layers | 1 - 2 |
Copper | One-sided or double-sided |
Surface | Electroless Nickel Immersion Gold |
Foil material | Polyimide |
Polyimide thickness | 50 μm |
Copper thickness | 18 µm |
PCB thickness | 0.2 mm |
Maximum size of the PCB | Length: 400 mm / Width: 250 mm |
Minimum size of the PCB | Length: 10 mm / Width: 10 mm |
Flex cover foil | Relief cut: 200 μm |
Minimum conductor width / conductor distance | 125 μm |
Vias | Via diameter: 200 μm |
Minimum distance Via-Via | 450 μm |
Minimal cutting radius | 100 μm |
Minimum distance copper contour | 200 μm |
Milling tolerance | +/- 100 μm |
Silkscreen | both sides |
Main Raw Materials of FPC
The main raw materials include: 1. base materials, 2. cover film,
3. reinforcement, 4. other auxiliary materials.
1) Substrate
1.1 Adhesive substrate
Adhesive substrates are mainly composed of three parts: copper
foil, adhesive, and PI. There are two types of single-sided
substrates and double-sided substrates. The material with only one
side of copper foil is a single-sided substrate, and the material
with double-sided copper foil is a double-sided substrate.
1.2 Adhesive-free substrate
The non-adhesive substrate is the substrate without the adhesive
layer. Compared with the ordinary adhesive substrate, the middle
adhesive layer is missing and composed of copper foil and PI. Thus,
the non-adhesive substrate is thinner than the adhesive substrate.
It also has other advantages, such as better dimensional stability,
higher heat resistance, higher bending resistance, and better
chemical resistance. Currently, it has been widely used.
Copper foil: At present, the commonly used copper foil thickness
has the following specifications, 1 oz, 1/2 oz, 1/3 oz. A thinner
copper foil with a thickness of 1/4 oz is also on the market.
However, this kind of material is currently used in China and makes
ultra-circuit (line width and line spacing are 0.05 mm and below)
products. With the increasing requirements of customers, materials
of this specification will be widely used in the future.
2) Cover film
It is mainly composed of three parts: release paper, glue, and PI.
In the end, only the glue and PI remain on the product. The release
paper will be torn off during the production process and will not
be used again (its role is to protect the glue from foreign
matters).
3) Flexible PCB Stiffener
The stiffener is a specific material used for FPC. It is used in a
specific part of the product to increase the support strength to
enhance the “soft” characteristic of FPC.
At present, The commonly used reinforcement materials are as
follow:
1) FR4 stiffener: The main components are glass fiber cloth and
epoxy resin glue, which are the same as the FR4 material used in
PCB.
2) Steel sheet stiffener: The composition is steel, which has
strong hardness and support strength.
3) PI stiffener: The same as the cover film, consisting of PI and
release paper. However, the PI layer is thicker, and it can be
produced from 2 MIL to 9 MIL.
4) Other auxiliary materials
1) Pure glue: This adhesive film is a heat-curing acrylic adhesive
film composed of protective paper/release film and a glue layer. It
is mainly used for layered boards, rigid and flexible boards, and
FR-4/Steel sheet reinforcement board, which plays a role in
bonding.
2) Electromagnetic protective film: Paste on the board surface for
shielding.
3) Pure copper foil: Only composed of copper foil, mainly used for
hollow board production.