10 Layer HDI PCB Board / Multilayer Pcb Board Green Solder Mask ENIG

Brand Name:WITGAIN PCB
Certification:UL Certificate
Model Number:P10E3589A0
Minimum Order Quantity:negotiable
Delivery Time:25 work days
Payment Terms:T/T
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Location: Shenzhen Guangdong China
Address: Block 11, International E-Commerce Logistic Center, PingHu Street, LongGang Distric, ShenZhen City
Supplier`s last login times: within 13 hours
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Product Details

10 Layer HDI Printed Circuit Board , PCB Board , Green Solder Mask , ENIG


PCB Specifications:


Layer Count: 10 Layer HDI PCB

Board Thickness: 1.6MM

Material: FR4 High TG

Min Hole: 0.1MM

Min Line: 3/3 Mil

BGA: 7Mil

Hole: L1-L2, L2-L3, L3-L8, L8-L9, L9-10, L1-L10

Solder Mask: Green

Surface Treatment: ENIG

Application: Consumer Electronics


Capabilities:


ItemCapability
Layer Count1-24 Layers
Board Thickness0.1mm-6.0mm
Finished Board Max Size700mm* 800mm
Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
Warp<0.7%
Major CCL BrandKB/NanYa/LTEQ/ShengYi/Rogers Etc
Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
Drill Hole Diameter0.1mm-6.5mm
Out Layer Copper Thickness1/20Z-8OZ ;
Inner Layer Copper Thickness1/3OZ-6OZ
Aspect Ratio10:1
PTH Hole Tolerance+/-3mil
NPTH Hole Tolerance+/-1mil
Copper Thickness Of PTH Wall>10mil(25um)
Line Width And Space2/2mil
Min Solder Mask Bridge2.5mil
Solder Mask Alignment Tolerance+/-2mil
Dimension Tolerance+/-4mil
Max Gold Thickness200u'(0.2mil)
Thermal Shock288C, 10s, 3 Times
Impedance Contro+/-10%
LTest CapabilityPAD Size Min 0.1mm
Min BGA7mil
Surface TreatmentOSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable

FAQ:


Questions: How many lamination times for this 10 Layer HDI PCB?

Answer: For this PCB, there are 3 times lamination in total.


Questions: What is the normal lead time for this kind of PCB?

Answer: The standard lead time for sample is about 3 weeks, for production is about 4 weeks. It may fluctuate according to production and orders status.


Questions: What is Blind Vias/Blind Holes?

Answer: Blind Vias connect the outermost layer of a multilayer PCB to a layer in the middle of the board. Blind vias can only be seen on one side of the board (that's where they get the name from). These vias enable designers to optimize their circuit layout by providing more space for routing. However, in comparison to Through-Hole Vias they are more difficult to construct and can cause the cost of constructing of the PCB to rise.



Questions: What Is Buried Vias/Buried Holes?

Anwer: A Buried Via hole connects layers inside a multi-layer PCB. These vias cannot be seen on the surface of a Printed Circuit Board. Buried vias are difficult to construct, as they need to be created in layers within the PCB. Designers like to use these vias, as they do not take up board space on every layer, thereby enabling smaller PCBs. High-density PCBs use buried vias.


China 10 Layer HDI PCB Board / Multilayer Pcb Board Green Solder Mask ENIG supplier

10 Layer HDI PCB Board / Multilayer Pcb Board Green Solder Mask ENIG

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