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4 Layer Printed Circuit Board With Blind Holes
PCB Specifications:
Layer Count: 4Layer HDI PCB
Board Thickness: 1.6MM
Material: FR4 TG150
Copper Thickness: 1/H/H/1OZ
Min Hole: 0.1MM
Blind Holes: L1-L2 0.1MM
Via Holes: L1-L4 0.2MM
Min Line: 6/8 Mil
BGA Size: 8.5Mil
Unit Size: 100M*110MM/6UP
Solder Mask: Black
Surface Treatment: Immersion Gold
Capabilities:
Item | Capability |
Layer Count | 1-24 Layers |
Board Thickness | 0.1mm-6.0mm |
Finished Board Max Size | 700mm* 800mm |
Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
Warp | <0.7% |
Major CCL Brand | KB/NanYa/LTEQ/ShengYi/Rogers Etc |
Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET |
Drill Hole Diameter | 0.1mm-6.5mm |
Out Layer Copper Thickness | 1/20Z-8OZ ; |
Inner Layer Copper Thickness | 1/3OZ-6OZ |
Aspect Ratio | 10:1 |
PTH Hole Tolerance | +/-3mil |
NPTH Hole Tolerance | +/-1mil |
Copper Thickness Of PTH Wall | >10mil(25um) |
Line Width And Space | 2/2mil |
Min Solder Mask Bridge | 2.5mil |
Solder Mask Alignment Tolerance | +/-2mil |
Dimension Tolerance | +/-4mil |
Max Gold Thickness | 200u'(0.2mil) |
Thermal Shock | 288C, 10s, 3 Times |
Impedance Contro | +/-10% |
LTest Capability | PAD Size Min 0.1mm |
Min BGA | 7mil |
Surface Treatment | OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable |
FAQ:
Quesion: What is Soak Testing or Endurance Testing of a PCB Board?
Answer: Soak Testing also known as Load Testing or Endurance testing is test performed to check the stability of the PCB over various extreme operating conditions for extended periods of time. For example, a PCB board may perform normally when used for 2 hours, but when the same board is used for 10 hours or more than that, then it may fail. Soak Testing is done to evaluate how the board will operate under different operating conditions for extended periods of time. Soak Testing should be done before the final deployment of the board.
Question: What is PCB Grid Testing or Bed of Nails Testing?
Answer: Grid testing or Bed of Nails testing is a process used to check the performance of components mounted on a PCB board. This test uses a frame/fixture that contains various pins inserted into an epoxy phenolic glass cloth laminated sheet (G-10) in order to access all the PCB test points. These pins act as sensors which are aligned to make contact with the test points on the PCB board and are also connected with a measuring unit through wires. The position of the pins is designed and customized for each PCB based on the components or points on the board that need to be tested.
A grid testing machine has three building blocks - a fixture, a bed of nails and software, to control the overall functionality of the machine. It usually has two cameras which are placed on the top and bottom of the machine in order to scan the whole board.
Advantages of PCB Grid Testing:
Limitations of PCB Grid Testing:
This type of testing is called In-Circuit Testing. Another test process used for In-Circuit testing is Flying Probe Testing.