Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards

Brand Name:WITGAIN PCB
Certification:UL Certificate
Model Number:S04E4696A0
Minimum Order Quantity:negotiable
Delivery Time:18 work days
Payment Terms:T/T
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Location: Shenzhen Guangdong China
Address: Block 11, International E-Commerce Logistic Center, PingHu Street, LongGang Distric, ShenZhen City
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Product Details

4 Layer Printed Circuit Board With Blind Holes


PCB Specifications:


Layer Count: 4Layer HDI PCB

Board Thickness: 1.6MM

Material: FR4 TG150

Copper Thickness: 1/H/H/1OZ

Min Hole: 0.1MM

Blind Holes: L1-L2 0.1MM

Via Holes: L1-L4 0.2MM

Min Line: 6/8 Mil

BGA Size: 8.5Mil

Unit Size: 100M*110MM/6UP

Solder Mask: Black

Surface Treatment: Immersion Gold


Capabilities:


ItemCapability
Layer Count1-24 Layers
Board Thickness0.1mm-6.0mm
Finished Board Max Size700mm* 800mm
Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
Warp<0.7%
Major CCL BrandKB/NanYa/LTEQ/ShengYi/Rogers Etc
Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
Drill Hole Diameter0.1mm-6.5mm
Out Layer Copper Thickness1/20Z-8OZ ;
Inner Layer Copper Thickness1/3OZ-6OZ
Aspect Ratio10:1
PTH Hole Tolerance+/-3mil
NPTH Hole Tolerance+/-1mil
Copper Thickness Of PTH Wall>10mil(25um)
Line Width And Space2/2mil
Min Solder Mask Bridge2.5mil
Solder Mask Alignment Tolerance+/-2mil
Dimension Tolerance+/-4mil
Max Gold Thickness200u'(0.2mil)
Thermal Shock288C, 10s, 3 Times
Impedance Contro+/-10%
LTest CapabilityPAD Size Min 0.1mm
Min BGA7mil
Surface TreatmentOSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable


FAQ:


Quesion: What is Soak Testing or Endurance Testing of a PCB Board?

Answer: Soak Testing also known as Load Testing or Endurance testing is test performed to check the stability of the PCB over various extreme operating conditions for extended periods of time. For example, a PCB board may perform normally when used for 2 hours, but when the same board is used for 10 hours or more than that, then it may fail. Soak Testing is done to evaluate how the board will operate under different operating conditions for extended periods of time. Soak Testing should be done before the final deployment of the board.


Question: What is PCB Grid Testing or Bed of Nails Testing?

Answer: Grid testing or Bed of Nails testing is a process used to check the performance of components mounted on a PCB board. This test uses a frame/fixture that contains various pins inserted into an epoxy phenolic glass cloth laminated sheet (G-10) in order to access all the PCB test points. These pins act as sensors which are aligned to make contact with the test points on the PCB board and are also connected with a measuring unit through wires. The position of the pins is designed and customized for each PCB based on the components or points on the board that need to be tested.

A grid testing machine has three building blocks - a fixture, a bed of nails and software, to control the overall functionality of the machine. It usually has two cameras which are placed on the top and bottom of the machine in order to scan the whole board.

Advantages of PCB Grid Testing:

  • Very Reliable method of PCB testing as all the points on the PCB board can be tested simultaneously.
  • Offers very good accuracy since it uses two cameras
  • Can easily detect manufacturing defects
  • An in-circuit tester is easy to program
  • Interpretation of test results is quite easy
  • It checks for Open, shorts, mission components, Wrong polarity, defective components, and current leakages in the circuit
  • Most of the parameters can be checked without applying power to the PCB under test

Limitations of PCB Grid Testing:

  • Fixtures used in bed of nails testing are expensive since they are mechanical and require a different wiring assembly for a different PCB board
  • Fixtures are mechanical so any change in the number of pins or their position require extra cost
  • This test doesn’t test continuity through connectors so there are the chances that the connectors’ faults may remain unnoticed.
  • Faults related to solder joints, excess solder, solder quality, and solder void also remain unidentified

This type of testing is called In-Circuit Testing. Another test process used for In-Circuit testing is Flying Probe Testing.


China Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards supplier

Blind Holes FR4 4 Layer PCB HDI Printed Circuit Boards

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