Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries
Certification:High QC standard, 100% inspection
Minimum Order Quantity:1PC
Delivery Time:10-14 days delivery time
Payment Terms:T/T
Price:Negotiable
Supply Ability:20000 pcs per month capacity
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28-4#, China Germany Park, Xuedian Town, Xinzheng City
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Product Details
Centerless Wheels
Resin:
High efficiency grinding in one batch, good sharpness, long using life
Vitrified:
high efficiency and good shape retention
Centerless grinding is a machining process that uses abrasive cutting to remove material from a workpiece. Centerless grinding differs from centered grinding operations in that no spindle or fixture is used to locate and secure the workpiece; the workpiece is secured between two rotary grinding wheels, and the speed of their rotation relative to each other determines the rate at which material is removed from the workpiece.
Features:
Resin:
High efficiency grinding in one batch, good sharpness, long using life
Vitrified:
high efficiency and good shape retention
Specification:
| Common Shape | Wheel Size | Grit Size | Classic Specification |
| 1A1 | Resin Maximum OD is 750mm Vitrified OD:300mm~500mm | Resin the finest grit size is 3000 |
Application
| Industry | Workpiece&Material | Machine | Bond | Working Data |
| Semiconductor and Photovoltaic industries | Ceramic, magnet, sapphire | Resin Vitrified |
Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries
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