Product Details
SOT-23 Plastic-Encapsulate MOSFETS
BC3400 N-Channel Enhancement Mode Field Effect Transistor
FEATURES
High dense cell design for extremely low RDS(ON)
Exceptional on-resistance and maximum DC current capability
Maximum ratings ( Ta=25℃ unless otherwise noted)
Parameter | Symbol | Value | Unit |
Drain-Source Voltage | VDS | 30 | V |
Gate-Source Voltage | VGS | ±12 | V |
Continuous Drain Current | ID | 5.8 | A |
Drain Current-Pulsed (note 1) | IDM | 30 | A |
Power Dissipation | PD | 350 | mW |
Thermal Resistance from Junction to Ambient (note 2) | RθJA | 357 | ℃/W |
Junction Temperature | TJ | 150 | ℃ |
Storage Temperature | TSTG | -55~+150 | ℃ |
Electrical characteristics (Ta=25℃ unless otherwise noted)
Parameter | Symbol | Test Condition | Min | Typ | Max | Units |
Off Characteristics |
Drain-source breakdown voltage | V(BR) DSS | VGS = 0V, ID =250µA | 30 | | | V |
Zero gate voltage drain current | IDSS | VDS =24V,VGS = 0V | | | 1 | µA |
Gate-source leakage current | IGSS | VGS =±12V, VDS = 0V | | | ±100 | nA |
On characteristics |
Drain-source on-resistance (note 3) | RDS(on) | VGS =10V, ID =5.8A | | | 35 | mΩ |
VGS =4.5V, ID =5A | | | 40 | mΩ |
Forward tranconductance | gFS | VDS =5V, ID =5A | 8 | | | S |
Gate threshold voltage | VGS(th) | VDS =VGS, ID =250µA | 0.7 | | 1.4 | V |
Dynamic Characteristics (note 4,5) |
Input capacitance | Ciss | VDS =15V,VGS =0V,f =1MHz | | | 1050 | pF |
Output capacitance | Coss | | 99 | | pF |
Reverse transfer capacitance | Crss | | 77 | | pF |
Gate resistance | Rg | VDS =0V,VGS =0V,f =1MHz | | | 3.6 | Ω |
Switching Characteristics (note 4,5) |
Turn-on delay time | td(on) | VGS=10V,VDS=15V, RL=2.7Ω,RGEN=3Ω | | | 5 | ns |
Turn-on rise time | tr | | | 7 | ns |
Turn-off delay time | td(off) | | | 40 | ns |
Turn-off fall time | tf | | | 6 | ns |
Drain-source diode characteristics and maximum ratings |
Diode forward voltage (note 3) | VSD | IS=1A,VGS=0V | | | 1 | V |
Note :
1. Repetitive Rating : Pulse width limited by maximum junction
temperature.
2. Surface Mounted on FR4 Board, t < 5 sec.
3. Pulse Test : Pulse Width≤300µs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production testing.
Company Profile
Guangdong Huixin Electronics Technology Co., Ltd. (hereinafter
referred to as Huixin ) is specialized in research, production,
sales and service of semiconductor devices. Huixin's factory lies
in Jiangsu Provicne of China, its management center is in southern
China, Guangdong Province.
Aiming at providing customers with efficient services, the sales
offices and service outlets have covered more than 30 regions of
the world, including Europe, America, India, Korea, Asia and
others.
Huixin has a wide range production line of discrete semiconductor,
including diodes, transistor, bridge rectifiers, mosfet, which have
been widely used in lighting, power supply, automotive electronics,
medical electronics, aerospace, communication products, household
appliances, smart meters and other fields.
With factory building area over 100,000 Sq.meters, monthly capacity
more than 1,000 million pieces, Huixin has become one of the
leading suppliers in electronic components industry in China.