Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant

Product feature
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time

Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications

Purchasing Information

Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)

Directions for use

• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes

Storage

Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.

Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certifications, with all products going through UL, SGS, RoHS certification.

AOK designs, develops and manufactures Thermal Interface Materials for industry leaders around the globe. Our core capabilities allow AOK to provide customers with customized solutions to meet their specific application needs.

Aochuan was founded in 2004. After 18 years, we have set up world class R&D system that made Aochuan leader of Thermal Interface Materials Industry in China.

Global Sales offices in Shenzhen, Heyuan, Taiwan, Toronto Canada North America, Europe
GMP 100,000 class Clean Workshop. over 12,000 m² independent park, 7 automated production lines, more than 5,000 tons annual production capacity

Long term partner : JLR, Commscope, OSRAM, BYD, ZTE, Hikvision, TP-LINK, Dahua, Delta, Foxconn ect.