Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking
Brand Name:AOK
Certification:RoHS, Reach, UL
Model Number:TP800
Minimum Order Quantity:1000 pcs
Delivery Time:13-15 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
302 GuihuaRoad, GuixiangVillage, GuanlanTown, LonghuaDistrict, Shenzhen City,Guangdong Province, P.R China
Supplier`s last login times:
within 28 hours
Product Details
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Product Details
Low Thermal Resistance 8 W/m.K Pink Silicone Thermal Pad Material
For Networking
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Pink | Visual |
| Thickness(mm) | 0.5~10 | astm d374 |
| Density(g/cc) | 3.35 | ASTM D792 |
| Hardness(shore oo) | 55±10 | ASTM D2240 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ＞6.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.2 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1012 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 8.0±0.5 | ASTM D5470 |
Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS
and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power
supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal
housing is used as heatsink.
Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking
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