16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
Brand Name:WITGAIN PCB
Certification:UL
Model Number:Multi-Layer PCB0025
Minimum Order Quantity:1 pcs/lot
Delivery Time:30 days
Payment Terms:T/T
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Shenzhen China
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Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
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Product Details
Multilayer Circuit Board 16 Layer PCB 2.0 MM Thickness
PCB Specifications:
1 Part NO: Multi-Layer PCB0025
2 Layer Count: 16 Layer PCB
3 Finished Board Thickness: 2.0MM
4 Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H1
5 Min Lind Space&Width: 3/3mil
6 Application Area: Industrial Control
Material Data Sheet:
| S1130 | |||||
| Items | Method | Condition | Unit | Typical Value | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 135 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 310 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 65 | |
| After Tg | ppm/℃ | 310 | |||
| 50-260℃ | % | 4.5 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | 13 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | <1 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 60S No Delamination | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 4.8E + 08 | |
| E-24/125 | MΩ.cm | 4.6E + 06 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 5.2E + 07 | |
| E-24/125 | MΩ | 5.3E + 06 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 120 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 60 | |
| Electrical Strength | IPC-TM-650 2.5.6.2 | D-48/50+D-4/23 | kV/mm | — | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.6 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.016 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Peel Strength(1oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.8 | |||
| 125℃ | N/mm | 1.6 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 600 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 500 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.15 | |
| CTI | IEC30112 | C-48/23/50, | ℃ | PLC 3 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Layer Stackup:
| Layer No. | Layer Type | Di-electric (Prepreg/ Core) | Di-electric constant | Processed Thickness (mil) | Target Impedance - Single Ended (+/- 10%) | Trace Width (Single ended) (mil) | Target Impedance – differential (+/- 10%) | Trace Width/ separation (differential pair) (mil) |
| MASK | 4.0 | 2.0 | ||||||
| 1 | TOP | Copper Foil 12 microns | 1.772 | 50 ohm 55 ohm | 7 6 | 100ohm 95ohm 90ohm | 5-8-5 5-6.5-5 5-5.5-5 | |
| PrepreG | 3.23 | 2.101 | ||||||
| PrepreG | 3.23 | 2.101 | ||||||
| 2 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 3 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 4 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 5 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 6 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 7 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 8 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 9 | POWER | Copper | 2.638 | |||||
| PrepreG | 3.23 | 0.788 | ||||||
| PrepreG | 3.23 | 0.788 | ||||||
| 10 | GND | Copper | 2.638 | |||||
| core | 3.37 | 3.9 | ||||||
| 11 | POWER | Copper | 2.638 | |||||
| PrepreG | 3.23 | 0.788 | ||||||
| PrepreG | 3.23 | 0.788 | ||||||
| 12 | POWER | Copper | 2.638 | |||||
| core | 3.37 | 3.9 | ||||||
| 13 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 14 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| CORE | 3.37 | 3.9 | ||||||
| 15 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 16 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| CORE | 3.37 | 3.9 | ||||||
| 17 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 18 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| CORE | 3.37 | 3.9 | ||||||
| 19 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 2.101 | ||||||
| PrepreG | 3.23 | 2.101 | ||||||
| 20 | SOLDER | Copper Foil 12 microns | 1.772 | 50 ohm 55 ohm | 7 6 | 100ohm 95ohm 90ohm | 5-8-5 5-6.5-5 5-5.5-5 | |
| MASK | 2.0 |
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
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