Matte Green Solder HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate
Brand Name:WITGAIN PCB
Certification:UL
Model Number:HDIPCB0015
Minimum Order Quantity:1pcs/lot
Delivery Time:25 days
Payment Terms:T/T
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Shenzhen China
Address:
Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
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HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate Green Solder Mask
PCB Specifications:
1 Part NO: HDIPCB0014
2 Layer Count: 10 Layer HDI PCB
3 Finished Board Thickness: 1.6MM
4 2+N+2 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L2-L9 0.2MM,L8-L9 0.1MM, L9-L10 0.1MM, L1-L100.2MM
5 Min Lind Space&Width:5/5mil
6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1
7 Application Area: Automobile
8 PCB Size: 154mm*143mm/1pcs
9 PCB Drawing File Size: Gerber File
X-OUT per panel:
1 X-OUT panel must be packed separately and marked clearly
2 A black X must be permanently marked on both sides of pcb
3 X-OUT per panel not be over 25%
4 X-OUT per lot not be over 5%
S1000-2 Data Sheet:
| S1000-2 | |||||
| Items | Method | Condition | Unit | Typical Value | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
| IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 345 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 220 | |||
| 50-260℃ | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 20 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | min | 5 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 100S No Delamination | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 2.2 x 108 | |
| E-24/125 | MΩ.cm | 4.5 x 106 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 7.9 x 107 | |
| E-24/125 | MΩ | 1.7 x 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 100 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 63 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.013 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.38 | |||
| 125℃ | N/mm | 1.07 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 562 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 518 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Matte Green Solder HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate
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