8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask

HDI PCB High Density Interconnected 8 Layer Black Solder Mask

Main Features:

1 8 Layer HDI PCB, high density printed circuit board.

2 Bline holes: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM, L7-L8 0.1MM

3 Buried holes: L4-L7 0.2MM.

4 Via holes: L1-L8 0.2MM.

5 PCB thickness is 1.0mm.

6 Min BGA ball size is 10mil.

7 Min line space and width is 2.5/2.5mil.

8 Material is FR4 Substrate, tg180 degree

9 S1000-2 material used.

S1000-2 Material data sheet:

Packing Specifications:

1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.

Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, ceramic pcb, HDI pcb, heavy copper pcb are also included. To meet our customer's diversified demands, we also accept prototype orders, small batch orders and big batch orders. Quality and technology is what we value most and we will never stop improving our capabilities. Our customers' satisfaction is always what we are seeking for.