Blue Solder Mask Silkscreen Circuit Board OSP PCB Surface Finish 1.0 MM Thickness
Brand Name:WITGAIN PCB
Certification:UL
Model Number:PCB0033
Minimum Order Quantity:1 pcs/lot
Delivery Time:20 days
Payment Terms:T/T
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Location:
Shenzhen China
Address:
Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
Supplier`s last login times:
within 1 hours
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Product Details
6 Layer PCB OSP Treatment Blue Solder Mask 1.0 MM Thickness
Printed Circuit Board Features:
1 6 Layer printed circuit board used in earphone
2 FR4 substrate material, tg 150 degree.
3 Black solder mask and white silkscreen.
4 ENIG, gold thickness 2U'
5 Finished pcb thickness 1.0mm.
6 35 um copper thcikness on each layer.
7 PCB file or gerber file should be offered by customer.
8 Customized printed circuit board.
9 Epoxy filled in vias.
Our history:
IT180A Data Sheet:
| IT-180ATC High Tg / Lead Free / High Reliability Laminate & Prepreg Excellent CAF resistance Good through-hole reliability Low CTE and high thermal reliability For automotive, high layer PCB, networking, and heavy copper applications Laminate properties | |||
| Items | IPC TM-650 | Typical Value | Unit |
| Peel Strength, minimum A. Low profile copper foil B. Standard profile copper foil | 2.4.8 | 5 8 | lb/inch |
| Volume Resistivity | 2.5.17.1 | 1x109 | M-cm |
| Surface Resistivity | 2.5.17.1 | 1x108 | M |
| Moisture Absorption, maximum | 2.6.2.1 | 0.10 | % |
| Permittivity (Dk, 50% resin content) A. 1MHz B. 1GHz | 2.5.5.9 2.5.5.9 | 4.5 4.4 | -- |
| Loss Tangent (Df, 50% resin content) A. 1MHz B. 1GHz | 2.5.5.9 2.5.5.9 | 0.014 0.015 | -- |
| Flexural Strength, minimum A. Length direction B. Cross direction | 2.4.4 | 500-530 410-440 | N/mm2 |
| Thermal Stress 10 s at 288°C A. Unetched B. Etched | 2.4.13.1 | Pass Pass | Rating |
| Flammability | UL94 | V-0 | Rating |
| Comparative Tracking Index (CTI) | IEC 60112 / UL 746 | CTI 3 (175-249) | Class (Volts) |
| Glass Transition Temperature(DSC) | 2.4.25 | 175 | ˚C |
| Decomposition Temperature | 2.4.24.6 | 345 | ˚C |
| X/Y Axis CTE (40℃ to 125℃) | 2.4.41 | 11-13 / 13-15 | ppm/˚C |
| Z-Axis CTE A. Alpha 1 B. Alpha 2 C. 50 to 260 Degrees C | 2.4.24 | 45 210 2.7 | ppm/˚C ppm/˚C % |
| Thermal Resistance A. T260 B. T288 | 2.4.24.1 | >60 20 | Minutes Minutes |
Blue Solder Mask Silkscreen Circuit Board OSP PCB Surface Finish 1.0 MM Thickness
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