High Lumen 36v 3030 Smd Chip On Board Led Grow Light Full Spectrum
Brand Name:PHOENIX
Certification:CE LM80 ROHS
Model Number:3030
Minimum Order Quantity:4000PCS
Delivery Time:7-10 DAYS
Payment Terms:Western Union, MoneyGram, T/T
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Site Member
Location:
Suzhou Jiangsu China
Address:
Bld#20,NO 88 Lingshan road ,wuzhong district,suzhou, jiangsu ,China
Supplier`s last login times:
within 26 hours
Product Details
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Product Details
Application introduction:
Industrial and mining lamps are an important part of modern industrial lighting. Traditional industrial and mining lamps often use 250W, 400W, 500W and 1000W metal halide lamps. Metal halide lamps emit light at 360 degrees. The disadvantages of large light loss cause a huge waste of energy. Therefore, the development of new led industrial and mining lamps with high efficiency, energy saving, long service life, high color rendering index and environmental protection is of great significance to the energy saving of national industrial lighting.
High lumen 36V 30MA 180lm 3030 PPT SMD LED CHIP USED FOR GYM LAMP AND SPORTS LAMP
Quick details:
| Input Voltage(V): | 36V |
| Warranty(Year): | 2-Year |
| Type: | Smd Led Chip 3030 |
| Lighting solutions service: | Lighting and circuitry design |
| Luminous Efficacy(lm/w): | 180lm |
| Lifespan (hours): | 50000 |
| Working Time (hours): | 20000 |
| Chip Material: | INGAN |
| Emitting Color: | Warm White/Natural White/COOL WHITE |
| Power: | 1W |
| Viewing Angle(°): | 120 Degree |
| Color Rendering Index(Ra): | 80 |
| Color Temperature: | 2700-6500K |
| Place of Origin: | Suzhou ,jiangsu |
| Application: | Gym light |
| Package Type: | Suface Mount Package |
| Forward Current: | 30MA |
| Size: | 3.0*3.0*0.7mm |
| Packing: | 4000 Pcs/Roll |
Product specification:
Package Structure:
Absolute Maximum Ratings:
| Item | Symbol | Absolute Maximum Ratings | Unit |
| Forward Current | IF | 30 | mA |
| Reverse Voltage | Vr | 5 | V |
| Pulsed Forward Current | IFP* | 30 | mA |
| Power dissipation | PD | 0.5 | W |
| Operating Temperature | TOP | -40~85 | ℃ |
| Storage Temperature | TST | -40~85 | ℃ |
| Electrostatic Discharge | ESD | 2000(HBM) | V |
| Junction Temperature | Tj | 120 | ℃ |
| LED Thermal resistance | Rth s-j | 33 | ℃/W |
LED Reliability Test List:
| Test Item | Test Conditions | Standard | Qty(Pcs) | Ac/Re |
| Life Test | 25℃,1000Hrs@30mA | / | 20 | 0/1 |
| High Temperature | 85℃,1000Hrs@30mA | / | 20 | 0/1 |
| Low Temperature | -40℃,1000Hrs@30mA | / | 20 | 0/1 |
| High Humidity Heat | 85℃,85%RH, 1000Hrs@30mA | / | 20 | 0/1 |
| Low Temperature Storage | -40℃,1000Hrs | JEITA ED-4701 200 202 | 20 | 0/1 |
| High Temperature Storage | 100℃,1000Hrs | JEITA ED-4701 200 201 | 20 | 0/1 |
| Temperature Cycle | (-40'C 30mins --25'C(5mins)--100'C(30mins) ,Temp changing rate:3+/-0.6'C/min) | JEITA ED-4701 100 105 | 20 | 0/1 |
| Thermal Shock | -40'C(15mins) --100'C(15mins),changing time <5mins ,300C | MIL-STD-202G | 20 | 0/1 |
Pulse Life Test | Tp=1ms,DC=0.1,D=Tp/T @ 3×30mA | / | 20 | 0/1 |
| ESD Test(HBM) | 2000V,200V/Step, Forward & Reverse Test both 3times | AEC (Q101-001) | 20 | 0/1 |
| Soldering Resistance | 260±5℃,10S,3times Pre-treatment 30℃,70%RH | JEITA ED-4701 300 302 | 20 | 0/1 |
| Reflow IV Decay | 260±5℃,10S,1time Pre-treatment 30℃,70%RH,168Hrs | / | 20 | 0/1 |
| Judgment Criteria | ||||
| Forward Voltage VF | VF Max-Increase < 1.1x | |||
| Reverse Current IR | IR Max-Increase < IRmax | |||
| Luminous Intensity IV | IV Decay < 40% | |||
※Solder ability test criteria:coverage is not less than 95% Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours) | ||||
Packaging:
Cautions:
The encapsulated material of the LEDs is silicone. Therefore the
LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence
to the reliability of the LEDs. Precautions Should be taken to
avoid the strong pressure on the encapsulated part. So when use the
picking up nozzle,The pressure on the silicone resin should be
proper.
Soldering iron :
When hand soldering, the temperature of the iron must less than
300℃ for 3 seconds
The hand solder should be done only one times
SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following
Product process :
High Lumen 36v 3030 Smd Chip On Board Led Grow Light Full Spectrum
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