ODM RGB 3030 Red Full Spectrum Led Chips 60-65LM 3v For Grow Light

Brand Name:PHOENIX
Certification:LM80 CE ROHS
Model Number:3030
Minimum Order Quantity:4000PCS
Delivery Time:7-10 DAYS
Payment Terms:Western Union, MoneyGram, T/T
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Site Member
Location: Suzhou Jiangsu China
Address: Bld#20,NO 88 Lingshan road ,wuzhong district,suzhou, jiangsu ,China
Supplier`s last login times: within 26 hours
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Product Details

Application Introduction:


In the electronic industry, backlight is a form of lighting, which is often used in LCD display. The difference between backlight and front light is that the backlight shines from the side or back, while the front light shines from the front as the name suggests. They are used to increase the illumination in low light source environment and the brightness on computer monitors and LCD screens to produce light in a similar way to CRT displays.


ODM Full Spectrum Cob RGB LED Chip 60-65LM 2835 3v

Quick details:]

Input Voltage(V):3V
Warranty(Year):2-Year
Type:Smd Led Chip 2835
Lighting solutions service:Lighting and circuitry design
Luminous Efficacy(lm/w):60-65lm
Lifespan (hours):50000
Working Time (hours):20000
Chip Material:INGAN
Emitting Color:Red /green /blue
Power:0.5W
Viewing Angle(°):120 Degree
Color Rendering Index(Ra):80
Packing bag:220*240nm
Place of Origin:Suzhou ,jiangsu
Application:Household appliances and traffic lights
Package Type:Suface Mount Package
Forward Current:150MA
Size:2.8*3.5*0.65mm
Packing:4000 Pcs/Roll


Product specification:


Package Structure:


Product Specification:


ItemSpecificationMaterialQuantity
ChipInGaNInGaN2 in 1
ReflectorWhitePCT
FrameC194Silver-Plated Copper
Gold wire0.9milAlloy
PhosphorYellowYAG
EncapsulantMilkyWhiteResin
Carrier tapeAccording to EIA 481-1A specsConductive black tape4000pcs per reel
ReelAccording to EIA 481-1A specsConductive black4000pcs per reel
LabelRepsn standardPaper
Packing bag220x240mmAluminum laminated bag/ no-zipperOne reel one bag
CartonRepsn standardPaperNon-specified

Absolute Maximum Ratings:


ItemSymbolAbsolute Maximum RatingsUnit
Forward CurrentIF150mA
Reverse VoltageVr5V
Pulsed Forward CurrentIFP*180mA
Power dissipationPD0.5W
Operating TemperatureTOP-40~85
Storage TemperatureTST-40~85
Electrostatic DischargeESD2000(HBM)V
Junction TemperatureTj120
LED Thermal resistanceRth s-j33℃/W

Typical Electro-Optical characteristics curves:

LED Reliability Test List:


Test ItemTest ConditionsStandardQty(Pcs)Ac/Re
Life Test25℃,1000Hrs@150mA/200/1
High Temperature85℃,1000Hrs@150mA/200/1
Low Temperature-40℃,1000Hrs@150mA/200/1
High Humidity Heat

85℃,85%RH,

1000Hrs@150mA

/200/1
Low Temperature Storage-40℃,1000Hrs

JEITA ED-4701

200 202

200/1
High Temperature Storage100℃,1000Hrs

JEITA ED-4701

200 201

200/1
Temperature Cycle(-40'C 30mins --25'C(5mins)--100'C(30mins) ,Temp changing rate:3+/-0.6'C/min)

JEITA ED-4701

100 105

200/1
Thermal Shock-40'C(15mins) --100'C(15mins),changing time <5mins ,300CMIL-STD-202G200/1

Pulse Life Test


Tp=1ms,DC=0.1,D=Tp/T @ 3×150mA/200/1
ESD Test(HBM)2000V,200V/Step, Forward & Reverse Test both 3times

AEC

(Q101-001)

200/1
Soldering Resistance

260±5℃,10S,3times

Pre-treatment 30℃,70%RH

JEITA ED-4701

300 302

200/1
Reflow IV Decay

260±5℃,10S,1time

Pre-treatment 30℃,70%RH,168Hrs

/200/1
Judgment Criteria
Forward Voltage VFVF Max-Increase < 1.1x
Reverse Current IRIR Max-Increase < IRmax
Luminous Intensity IVIV Decay < 40%

※Solder ability test criteria:coverage is not less than 95%

Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours)



Packaging:

Cautions:

The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the

Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.


Soldering iron :
When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
The hand solder should be done only one times

SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following

Handling Precautions :
Handle the component along the side surface by using forceps or appropriate tools
Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry
Do not stack together assembled PCBs containing LEDs. Impact may scratch the silicone lens or damage the internal circuitry



Product features:


Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation

High brightness ,low attenuation high color rendering

Minimum 70,80,90 95 CRI options

Strong welding and good stability undead light

Product series and company logo on the front

CE ROHS LM80 Certification


Production Process:



China ODM RGB 3030 Red Full Spectrum Led Chips 60-65LM 3v For Grow Light supplier

ODM RGB 3030 Red Full Spectrum Led Chips 60-65LM 3v For Grow Light

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