Small Volume Quick Prototype Turnkey PCB Assembly Printed Circuit Assembly
Brand Name:CESGATE
Certification:UL、IATF16949、ISO9001
Model Number:NA
Minimum Order Quantity:1PCS( NO MOQ)
Delivery Time:3-7 working days
Payment Terms:T/T, L/C
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Site Member
Location:
Chengdu Sichuan China
Address:
3602, Unit 1, Building 2, Phase 3, Longhu Zichen Xiangsong, Huazhaobi Xiaheng Street, Jinniu District, Chengdu, China
Supplier`s last login times:
within 25 hours
Product Details
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Product Details
Small Volume Quick Prototype Turnkey PCB Assembly Printed Circuit Assembly
Types and uses of PCBs
(A) 4-layer board
The substrate material is mainly epoxy glass fiber cloth. The main
uses are personal computers, medical electronic equipment,
measuring instruments, semiconductor testing machines, numerical
control machines, electronic switches, communication machines,
memory circuit boards, IC cards, etc.
(B) 6-8 layer board
The substrate material is still mainly epoxy resin glass fiber
cloth. Most of them are used in electronic switches, semiconductor
testing machines, mid-range personal computers, engineering
workstations and other machines.
(C) 10 layers or more
The material is mainly glass benzene resin material, or epoxy resin
is used as the multi-layer PCB substrate material. The application
of this type of PCB is special, and it is used in large industrial
computers, high-speed computers, defense machines, communication
machines, etc.
CESGATE's advantages of turnkey PCB assembly
1. As a one-stop service shop, thoughtful Turnkey PCB Assembly will
start from your inquiry to after-sales.
2. Free design stack-up service, modify until you are satisfied.
3. Each process is monitored by specialized quality inspection
personnel to detect problems in time and solve them as soon as
possible.
4. Expedited service is supported.
5. Turnkey PCB Assembly
Specification
| Article | Description | Capability |
| Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... |
| Board Cutting | Number of layers | 1-48 |
| Min.thickness for inner layers (Cu thickness are excluded) | 0.003”(0.07mm) | |
| Board Thickness | Standard | (0.1-4mm±10%) |
| Min. | Single/Double:0.008±0.004” | |
| 4layer:0.01±0.008” | ||
| 8layer:0.01±0.008” | ||
| Bow and twist | no more than 7/1000 | |
| Copper Weight | Outer Cu weight | 0.5-4 0z |
| Inner Cu weight | 0.5-3 0z | |
| Drilling | Min size | 0.0078”(0.2mm) |
| Drill deviation | ±0.002″(0.05mm) | |
| PTH hole tolerance | ±0.002″(0.005mm) | |
| NPTH hole tolerance | ±0.002″(0.005mm) | |
| Solder Mask | Color | Green,white,black,red,blue… |
| Min solder mask clearanace | 0.003″(0.07mm) | |
| Thickness | (0.012*0.017mm) | |
| Silkscreen | Color | white,black,yellow,blue… |
| Min size | 0.006″(0.15mm) | |
| Max Size of Finish Board | 700*460mm | |
| Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
| PCB Outline | Square,circle,irregular(with jigs) | |
| Package | QFN,BGA,SSOP,PLCC,LGA | |
RFQ:
| Q: The Wire Bonding process is required when the circuit board is
printed. What should I pay attention to when making the circuit
board? CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”～5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”. |
| Q: The lead-free process is required when the circuit board is
printed. What should I pay attention to when making the circuit
board? CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material. |
| Q: Can your company provide the serial number when making circuit
board text? CESGATE: Serial numbers can be provided, and in addition to text serial numbers, QR-CODE can also be provided for customers to query. |
| Q: How long is the shelf life of the PCB board and how should it be
stored? CESGATE: 25℃ / 60%RH is recommended when the PCB is stored. The plate itself has no shelf life, but if it exceeds three months, it needs to be baked to remove moisture and stress, and it should be used immediately after baking. It is recommended that the pieces should be loaded within 6 months of storage to reduce the phenomenon of rejection and explosion. |
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Small Volume Quick Prototype Turnkey PCB Assembly Printed Circuit Assembly
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