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Welcome To Senyan.
----Senyan_over 10 years professional PCB & PCB Assembly Manufacturer in China.
Quality First!
Customers First!
Making you more successful!
PCB / PCBA / PCBA Design / One-stop Service
Senyan has a dedicated team of professionals to guide you at every
step - from sourcing to overcoming any potential challenges along
the way.
Our complete factory production system and strict quality
requirements have helped hundreds of customers finished successful
projects.
1. PCB fabrication.
2. One-stop PCBA: PCB+components sourcing+SMD and through-hole assembly
3. PCB clone, PCB reverse engineering.
Our advantage:
1. Free programming and free functional test, free package.
2. High quality: E-test, X-ray, AIO test, QC, 100% funtional test.
3. Professional service. ISO SMT and through hole assembly, over 10 years experience.
4. Warranty period: 2 years.
We work to supply small and large batches of competitively priced
printed circuit boards to our customers.
Your Troubles | Our Strategy | |||
Lack of engineering experience Various unexpected problems, causing the project to fail | Rich engineering experience: Bom Engineer/ Product Engineer/
Technical Engineer /Purchasing Engineer.Eliminate Problems and
pitfalls at the design stage | |||
Coordinating multiple suppliers Insufficient time and energy | PCB Assembly and welding factory, Component procurement
team,Function Test , Finished Product Assembly. Provide one-stop
service, save time and worry | |||
Product quality control High hardware trial and error cost | Rigorous process and strong strength We have established a standardized and rigorous process and system
to effectively reduce quality problems | |||
Traders do not have physical factories The quality is not guaranteed, Documents easy to disclose | Own teams and factory, the delivery time is more controllable | |||
Hard delivery guarantee The market can't wait | Complete Organizational Structure: Project Department, Engineering
Department, Purchasing Department, Quality Department, Production Department, Etc. |
Detailed for Pcb Assembly
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technolog
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity
With Large Monthly Production Capacity
With the help of our 15 CAM engineers, 15 SMT machine engineers and
10 BOM analysis engineers, our PCB production capacity can reach
40,000 square meters and EMS assembly capacity at 150 million
components per month. Moreover, our reliable world-famous brand
component procurements are as follows:
Global procurement database
Distribution partnership
Flexible stocking programs
Integrated customer registered pricing
Extensive global supply chain
OEM sourcing agreements
SMT Manufacturing Capability | |||
Item | Manufacturing Capability in process | Manufacturing Method | |
Production size(Min/Max) | 50×50mm / 500×500mm | ||
Production board thickness | 0.2 ~ 4mm | ||
Printing solder paste | Support method | Magnetism fixture, vacuo platform | |
Clamping method | Sticking up by vacuo, clamping on both sides ,flexible clamping
with sheet, flexible clamping with thick board | ||
Cleaning Method of printing solder paste | Dry method+ wetting method+ Vacuo method | ||
Accuracy of printing | ±0.025mm | ||
SPI | Repeated accuracy of volume | <1% at 3σ | |
Mounting component | Components size | 0603(Option) L75mm Connector | |
Pitch | 0.15mm | ||
Repeated accuracy | ±0.01mm | ||
AOI | FOV size | 61×45mm | |
Test speed | 9150mm²/Sec | ||
3D X-ray | Shootingangle | 0-45 |
Detail For PCB:
Item | Capability |
1.Base Material | FR-4 / High TG FR-4 /Aluminum /CEM-1/Rogers/Arlon/Taconic/Teflon |
2.Layers | 1-22 |
3.Finised inner/outer copper thickness | 1-6OZ |
4.Finished board thickness | 0.2-7.0mm |
5.Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm |
6.Controlled Impedance | +/-5% |
7.Plugging vias capability | 0.2-0.8mm |
8.Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
9.Surface treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion
Silver, Hard gold, Flash gold, OSP… |
FAQ: