2 Layer Flex PCB Board 0.5mm 3mil ENIG Quick Turn PCB Assembly

Brand Name:Huashengxin
Certification:UL , ISO9001
Model Number:ED9A8114
Minimum Order Quantity:1pcs
Delivery Time:fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production
Payment Terms:T/T
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Verified Supplier
Location: Shenzhen Guangdong China
Address: RM1510, YUNHUA TIMES, Shajing Street, Baoan District, Shenzhen,Guangdong, China
Supplier`s last login times: within 25 hours
Product Details Company Profile
Product Details

2 Layer Flex PCB Board 0.5mm 3mil ENIG Quick Turn PCB Assembly


Flex PCB Board 2 Layer Flexible PCBA Flex PCB Assembly Quick Turn PCB Assembly Flexible Pcb Assembly


2 Layer Flexible PCBA


Flexible printed circuits are circuit boards that have the ability to bend or twist. From this assertion, it is obvious that they are distinguished by a flexible construction. That is why electronic engineers and designers use them in applications that demand for their qualities. They are also referred to as flex circuits and are mostly used in small electronic applications. Since they are characterized by their ability to bend, flexible printed circuits are made of flexible substrate such as polyimide. Another important quality of flexible printed circuits is that they have superior heat dissipation than printed circuit boards. It is this quality that makes it possible for the electronics that use it to stay in quality condition for a long time.


HSX products cover 1~32L FR-4 PCB, IMS PCB,HDI Boards, high frequency PTFE boards and Rigid-flex boards etc. It provides flexible quick turn production services (12 hours to72 hours), as well as small volume to big volume PCB manufacturing.Products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products, industrial control, science and education, medical devices, and aerospace.


FPC Technology Capability
Attribute (All dimensions are mils unless
otherwise specified)
Mass Production (Yield
80%,Cpk1.33)
Small Amount(Yield60%, Key
Specification Yield80%
Sample
FPC(yes/no)yesyesyes
Layer count/Structure, Max.246
Size(L×W), Max.550mm*250mm550mm*250mm700mm*250mm
Nominal thickness (mm)0.1~0.50.1~0.50.1~0.8
Thickness tolerance±10%(>0.3mm)/±0.03mm(0.3mm)±10%(>0.3mm)/±0.03mm(0.3mm)±10%(>0.3mm)/±0.03mm(0.3mm)
Surface finish typeENIGENEPIGOPSI-SilverI-Tin HASLHard GoldENIGENEPIGOPSI-SilverI-Tin HASLHard GoldENIGENEPIGOPSI-SilverI-Tin HASLHard Gold
Soft ENIG(yes/no)nonono
Base material typePIPIPILCPTK
Coverlay thickness (um)28/50/60/8028/50/60/8028/50/60/80
Adhesive thickness (um)25/40/50/6525/40/50/6525/40/50/65
Copper thickness, Min./Max. (um)12-7012-7012-70
Base material thickness, Min./Max. (um)25-7525-7525-100
Mechanical drilled thru-hole size (DHS), Min.0.150.150.15
Plating aspect ratio, Max.3:13:15:1
Pad size, Min.With through hole:0.4mm
Without through hole:0.2mm
With through hole:0.4mm
Without through hole:0.2mm
With through hole:0.3mm
Without through hole:0.2mm
Pad size tolerance20%20%10%
Pad to pad space, Min.4mil4mil4mil
Pad to outline tolerance±3mil±3mil±2mil
Pattern location accurancy±3mil±3mil±2mil
Pattern location accurancy from top side to bottom±3mil±3mil±2mil
Laser via hole diameter/pad, Min.4/12mil4/10mil4/10mil
Outerlayer(Hoz+plating) line width/space, Min.3/3mil3/3mil2/2mil
Innerlayer(Hoz) line width/space, Min.3/3mil3/3mil2/2mil
Inner line width tolerance±10%±10%±10%
Outerlayer registration, Min. (Pad diameter = DHS + X)DHS + 8DHS + 8DHS + 6
Innerlayer registration, Min. (Pad diameter = DHS + X)(L4 layer)DHS + 10DHS + 10DHS + 8
Laser via hole pitch, Min.0.40mm0.40mm0.35mm
Mechanical hole pitch, Min.0.50mm0.50mm0.40mm
Drilled hole position tolerance±2mil±2mil±2mil
Hole size tolerance±2mil±2mil±2mil
Location accurancy from tooling hole(PTH&NPTH) to pad±3mil±3mil±2mil
Location accurancy from tooling hole(PTH&NPTH) to outline±3mil±3mil±2mil
Outline size tolerance±2mil±2mil±2mil
LPI registration/dam, Min.2mil/4mil2mil/4mil2mil/3mil
LPI dam on CVL8mil8mil8mil
Coverlay open window/damΦ0.5mm/0.3mmΦ0.5mm/0.3mmΦ0.3mm/0.2mm
Coverlay registration/Resin flow4mil4mil2mil
Stifferness materialFR4/PI/SteelFR4/PI/SteelFR4/PI/Steel
Stifferness dam, Min.12mil12mil8mil
Stifferness registration/Resin flow8mil/4mil8mil/4mil4mil/2mil
Impedance tolerance10%10%5%
Thermal reliability(LPI, FCCL, CVL)288°/10s/3times288°/10s/3times288°/10s/3times
Qualified material and structure ULPIPIPI


FAQ:

Q1:Are you a factory or trade company?
A: Yes, we are the factory, we have independent quick turn prototype PCB manufacturing & big volume PCB production lines.


Q2:What kind of PCB file format can you accept for production?
A: Gerber, PROTEL 99SE, PROTEL DXP, POWER PCB, CAM350, ODB+(.TGZ)


Q3:Are my PCB files safe when I submit them to you for manufacturing?
A: We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written permission from your side, nor we'll share these files with any other 3rd parties. And we could sign NDA with client if necessary.


Q4:If we have no PCB file/Gerber file, only have the PCB sample,can you produce it for me?
A: Yes,we could help you to clone the PCB. Just send the sample PCB to us, we could clone the PCB design and work out it.


Q5:What is your standard lead time for PCB?
A: Sample/prototype(less than 3sqm):
1-2 Layers: 3 to 5working days (fastest 24hours for quick turn services)
4-8 Layers: 7~12 working days (fastest 48hours for quick turn services)
Mass production (less than 200sqm):
1-2 Layers:7 to 12 working days
4-8 Layers:10 to 15 working days


Q6:What payment do you accept ?
A: Wire Transfer(T/T) or Letter of Credit(L/C) or Paypal(only for small value less than 500usd)


China 2 Layer Flex PCB Board 0.5mm 3mil ENIG Quick Turn PCB Assembly supplier

2 Layer Flex PCB Board 0.5mm 3mil ENIG Quick Turn PCB Assembly

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