Laser Direct Imaging PCB 50/75μM Outer Solder Bridge/Opening Process
Brand Name:GIS
Model Number:DPX820SM
Place of Origin:Suzhou, China
Board thickness:0.5~3.5mm
Laser power:Mixing Wave Total Power 512W
Solder bridge/solder opening:50/75μm（process Condition）
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Suzhou China
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Floor 2, Building 2, Ruijing Building, No.868, Jinshan South Road, Mudu Town, Wuzhong District, Suzhou
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Product Details
Laser Direct Imaging PCB 50/75μM Outer Solder Bridge/Opening Process
Product Description:
Laser Direct Imaging PCB is a high-quality printed board with laser-direct imaging technology. It is widely used in PCB, HDI and FPC production. Its effective exposure area is up to 620x720mm (24"x28.5"), and the conventional solder bridge/solder opening is 50/75μm (process condition). It provides four kinds of solder mask color: fixed scale, auto scale, interval scale and partition alignment. The file format support is also included. Laser Direct Imaging Printed Board is a reliable and cost effective solution for Printed Circuit Board production. Laser Direct Imaging Printed Circuit Board is reliable and cost effective for PCB production.
Features:
- Laser Direct Imaging Printed Circuit Board (Laser Direct Imaging PCB): An advanced type of Printed Circuit Board (PCB) production that uses a laser beam to directly transfer circuit patterns onto the board.
- Solder Mask Ink: The solder mask ink used for Laser Direct Imaging Printed Circuit Board (Laser Direct Imaging PCB) is 30s@600x500mm(24"×20").
- Application: Laser Direct Imaging Printed Circuit Board (Laser Direct Imaging PCB) is used for PCB, HDI, and FPC.
- Solder Bridge/Solder Opening: The solder bridge/solder opening used in Laser Direct Imaging Printed Circuit Board (Laser Direct Imaging PCB) is 50/75μm(process Condition).
- Effective Exposure Area: The effective exposure area for Laser Direct Imaging Printed Circuit Board (Laser Direct Imaging PCB) is 620x720mm(24"x28.5").
- Solder Mask Color: Laser Direct Imaging Printed Circuit Board (Laser Direct Imaging PCB) can use fixed scale/ auto scale / interval scale / partition alignment for its solder mask color.
Technical Parameters:
| Parameter | Value |
|---|---|
| Solder mask ink | 30s@600x500mm(24"×20") |
| Scale mode | White, Black, Yellow, Etc. |
| Laser power | Mixing Wave Total Power 512W |
| Solder Mask Color | Fixed Scale/ Auto Scale / Interval Scale / Partition Alignment |
| Application | PCB,HDI,FPC |
| Alignment method | PAD(diameter: 0.5~3.0mm) |
| File format | File Format |
| Line width tolerance | ±10% |
| Board thickness | 0.5~3.5mm |
| Effective exposure area | 620x720mm(24"x28.5") |
Applications:
Laser Direct Imaging PCB: GIS DPX820SM
The GIS DPX820SM Laser Direct Imaging PCB is an advanced printed circuit board solution with advanced features for high-end applications. It is manufactured in Suzhou, China and features a fixed scale/auto scale/interval scale/partition alignment for soldermask color, a board thickness ranging from 0.5mm to 3.5mm, and an alignment accuracy of ±12um. The line width tolerance is ±10%.
The GIS DPX820SM Laser Direct Imaging PCB is specifically designed for Laser Direct Imaging Printed Circuit Board (LDI PCB) and Laser Direct Imaging Circuit Board (LDICB). In comparison to traditional printed circuit boards, LDI PCBs and LDICBs are much more efficient and reliable. The laser imaging process used in the GIS DPX820SM Laser Direct Imaging PCBs ensures that the board is well-protected from any external damage and maintains a high level of accuracy. This makes it an ideal solution for high-end applications, including medical, industrial, and automotive industries.
The GIS DPX820SM Laser Direct Imaging PCB is a reliable and cost-effective solution for any high-end application. With its advanced features, it offers superior performance and reliability while maintaining a high level of accuracy and protection. It is an ideal choice for any application that requires a reliable, efficient, and cost-effective solution.
Customization:
GIS DPX820SM Laser Direct Imaging Printed Board (Laser Direct Imaging Printed Circuit Board, Laser Direct Imaging Print Board) from Suzhou, China offers unbeatable performance with its scale mode options (White, Black, Yellow, Etc.), solder mask ink of 30s@600x500mm(24"×20"), application of PCB,HDI,FPC, solder bridge/solder opening at 50/75μm(process Condition), and alignment accuracy of ±12um.
Packing and Shipping:
Packaging and Shipping for Laser Direct Imaging PCB:
We use shock-resistant and moisture-proof packaging materials to ensure that products reach customers in perfect condition. We use high-quality carton boxes, bubble wraps and other packing materials to ensure that products are not damaged during shipping. We ship products through air freight, land transportation and sea transportation according to customer requirements. We are also willing to cooperate with customers to use their own logistics services.
FAQ:
Q1: What is Laser Direct Imaging PCB?
A1: Laser Direct Imaging PCB, also called GIS DPX820SM, is a PCB imaging technology from GIS, a Suzhou, China-based brand. It uses a laser beam to directly etch a circuit pattern on a PCB without the need for a phototool.
Q2: What are the advantages of Laser Direct Imaging PCB?
A2: Laser Direct Imaging PCB offers a number of advantages, including higher accuracy and resolution, faster production times, and a higher yield rate.
Q3: What are the applications of Laser Direct Imaging PCB?
A3: Laser Direct Imaging PCB technology is used for a variety of applications, including automotive, medical, and consumer electronics.
Q4: What materials can Laser Direct Imaging PCB be used on?
A4: Laser Direct Imaging PCB technology can be used on copper, aluminum, and other conductive metals and materials.
Q5: What is the resolution of GIS DPX820SM laser direct imaging
PCB?
A5: GIS DPX820SM laser direct imaging PCB has a resolution of 0.2mm, allowing for extremely precise etching of circuit boards.
Laser Direct Imaging PCB 50/75μM Outer Solder Bridge/Opening Process
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