bga connector

10148901-192SLF 56Gb/s High Speed Mezzanine System 520POS [MJD Advantage] + 15 years experience for electronic components + S...

... Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications: , CSP , LED , Flip Chip , Semiconductor, Battery Ind...

... rechargeable Lithium button cell Application: Widely applied for , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Sm...

... performance have made it one of the most widely used in RF and Microwave applications across the board.Normally utilized in frequency r...

ADF4371BCCZ BGA Clock Generator, PLL, Frequency Synthesizer Brand New And Original Integrated Circuit Chip PRODUCT DESCRIPTION Part number ADF4371BCCZ...

...​ Product Description : --- Spring loaded pin(single) for PCB , ICT , FCT testing , etc --- Pogo pin ( ) to establish a ( usuall...

X-Ray Inspection Equipment Product Description: Widely applied for , CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small ...

XC7Z100-2FFG900I Bga900 Embedded Communication Chip XC7Z100-2FFG900I XC7Z100-FFG900 XC7Z100-2FFG900 XC7Z100 FBGA900 IC Our goods: Active components (I...

... on both sides Yes Smallest Chips size 0201 Min and Micro pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Mi...

..., SOP/SOJ, QFP, ,PLCC, CSP/, long ~ 0402-31 mm components, (L100mm x W31mm) - >mind vision camera, 0603 - more than 31 type...

...chip carriers/, VF, FPGA and DFN 4. and terminals PCB Assembly services SMT Assembly Automatic Pick & Place Component Placement as...

... and socket lands All burn-in board styles available , LGA, PGA, QFP, TSOP, micro-, SOJ, PLCC, DIP, or custom-designed sockets -55°...

PCB Assembly, Electronic product Contract Manufacturing Services, subcontractor, print circuit board Assembly Services, EMS/OEM Manufacturing, Electro...

PCB Assembly, Electronic product Contract Manufacturing Services, subcontractor, print circuit board Assembly Services, EMS/OEM Manufacturing, Electro...

... Mainly used for discrete components, IC lead frames, LED lighting, relays, terminal substrate heat sink materials and , ...

... BUMP GRID ARRAY PACKAGE HEIGHT MM 11.180 PACKAGE LENGTH MM 14.730 PACKAGE WIDTH MM 17.270 POE RATING 4PAIR POE 30W SPEED 1000BASE-T TEMPERATURE...

... And Terminals Product Description: SMT is a Printed Circuit Assembly (PCBA) provider committed to delivering high-quality, cost-effectiv...

...tem 20 fps 650mm*550mm 1.Applications: 1. Semiconductor 2. Electronic Module 3. Automotive electronics 4. Mold Plastic Parts 5. Aircraft ...