dip ic package

...) TA8217P TOSHIBA Integrated Circuits Components Specification : TA8217P Category Integrated Circuits () Product Name Electronic compo...

...-8 , this converter offers efficient and reliable performance in a small form factor. Operating with a nominal input voltage of 3.3 VDC, the...

62684-401100ALF SMD / SMT FFC & FPC Connectors FCI / Amphenol Product Category: FFC & FPC Connectors RoHS: Details Product: Board Mount Number of Posi...

... Substrate fabrication Application:bank card, card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,Micro...

...Wide Operating Voltage: 3.3V to 36V • RoHS Compliant • Low Profile -8 • Low Cost Why buy from us >>> Fast / Safely / Conveniently • SKL...

Transportation AFC chip Card Reader Writer , EMV NCR ATM Parts Description: • &RF card read &write • Automatically lock the card,manual/auto ...

1.778MM Socket Connector Dual Row 2 X 16P Female Header Straight 1.778MM Socket Connector Dual Row 2 X 16P Female Header Straight DI...

TDA1517P/N3 Audio frequency amplifier DIP ic chips Products Description: 1. Requires very few external components 2. High output power 3. Fixed gain 4...

...Pins: 16-40 Pin 5.Type: Socket 6.Feature : Test Socket Including: 5 PCS 40 Pin 40Pin Universal ZIF Socket Lock Socket About ou...

... Socket Round Hole 7.62mm Connector Moisture Proof Forces polished steel gauga Φ0.43mm Insertion 200g Max/Pin, Withdrawal:60g Min/Pin Operati...

2 layers of COF,electric annoyed liquid crystal drive, Substrate,palladium gold,,pcb production Product Description Product area: ...

2.54mm Turned Pin Contact Type Socket With Pin Length 7.43mm Description: socket is an electrical connector used in the field of electro...

MAX690CPA+ WR Electronic Component Electronic Ic Chip Color TV Ic chip ic diode 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH +-15-kV ESD...

The GP3A200LCS,from Sharp Microelectronics,is semiconductors-Integrated Circuits - ICs.what we offer have competitive price in the global market,which...

...Standard Plastic JEDEC Matrix Trays for Customized JEDEC Standard Design Tray For Parts JEDEC tray is the tray used by th...

...Molding System Semiconductor equipment is mainly used in TO, SOP, SSOP, TSSOP, , SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IP...

FSBB20CH60C Automotive IGBT Modules 600V 20A Intelligent Power Module DIP-27 Package Product Description Of FSBB20CH60C FSBB20CH60C is an advacned Mot...

...game - changer in the field of high - reliability . Made of high - purity silver, this bonding wire offers excellent electrical conduct...

LM358P IC OPAMP GP 2 CIRCUIT 8DIP Texas Instruments Product Details LM358P Description These circuits consist of two independent, high gain, internall...