high thermal conductivity epoxy

... encapsulant compound. lt is design for potting of capacitors and electricaldevices. TIE280-12AB-Series-Datasheet (2).pdf Feature > Good ther...

... cured, long pot life, fire resistant encapsulant compound. It is design for potting of capacitors and electrical devices. Features > Good th...

Performance One Component Glue for electronic potting compound Product Summary: TIETM380-25 is a one component, heat c...

... resin, combined with LH-9215, a liquid modified carboxylic anhydride hardener. This adhesive is designed to protec...

pcb Lighting PCB MC PCB Aluminum pcb Power COB lights PCB led pcb PCB Type Material Type Material Brand Single side pcb...

...tem. No matter what your resin application requirements look like: we can do most of them in our fully equipped lab. We can handle 1- and 2-compone...

... Sealed Bead NTC Thermistor 30KOhm 3950 With UL4411 24AWG 2C 125C 300V Cable Overview The BetaCURVE Chip NTC Thermistor i...

...Dosing System 2 Component Ab Mixing Dispensing Machine Silicone Compound Potting Machine Potting is a method for process...

Single Part Fillers Dispensable Material for LED Discription of Single Part Fillers: Thermally Conducti...

... versus deflection characteristics. The combination will allow minimal stress on components while also yielding low resistance. As a result...

... with resin, and carbon fiber prepreg. In the process of compression molding, carbon fiber prepreg is placed into mold, now the prepreg gets ...

Bonded Fin Aluminum Heat Sink Material: 6063 T5 Aluminum Alloy Surface: Clear Anodised Advantages of aluminum ......

Low Volatility Silicone Pad For Industrial Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - Color ...

Fr4 TG 170 / 180 PCB Circuit Board TG PCB Specification: Material: TG fr4(S1170,KB6168),Isola optional Layer:...

... dissipate heat generated by electronic components. These PCBs are made using aluminum as the base material, which has excellent thermal conductivi...

..., derived from -sensitive-resistor, was coined to describe a form of resistive device that possesses a large temperaturecoefficient of res...

... COS series device package Diamond copper composite material is composed of diamond and copper. It has the characteristics...

... physical state of the material will change significantly, from solid to liquid or from liquid to solid. This phase change characteristic is the ke...

... requirement. Red copper is pure copper, also known as copper, has good and , excellent p...