polyimide resin

.... It has an adjustable temperature range of -40 to 260℃ and weighs only 0.01kg. The PI heating film is also available in a custom color of yellow/b...

... Max 1.0mm Epoxy Encapsulated Micro NTC Chip Thermistor Brief Introduction: This product is a miniature medical temperature sensor N...

... OD Grinding. Applications: Surface Grinding, Profile Grinding, Side Grinding, Flute Grinding, Micro-drills Bond Availability: Phenol, , H...

HUNTSMAN PI Powder Matrimid 5218&9725 NMP DMF DMAC Dissolve Filter Hollow Fiber Membrane All Color #detail_decorate_root .magic-0{marg...

.... The , pressure sensitive, adhesive tape with silicon , shows excellent dielectric insulation properties, high heat resistance and e...

... Processing Technology: Electrolytic Foil Insulation Materials: Epoxy Copper Thickness: 1/1 Oz Surface Finish: Immersion Gold Solder Mask: Ye...

...easy dressing such characteristics. Application: Different from Hybrid bond's aggressive ability, Bond grinding wheel offers better surface q...

...260C) offering superior PTH reliability. • Maini mechani 1 strength and bonding sngth at high temperature. • Tough systemNon-MOAemist • Haelf...

... Pcb Board FPC Product description FPC are also called flexible circuit boards. Referring to the soft board, the flexible circuit board ha...

Multi Layer Custom PCBA Circuit Board Rigid PCB Blue FR4 Epoxy Capacity: 1 Layer 1-20 layers 2 Material FR-4, etc 3 Board thickness 0.0...

Dual Inline Package SMD/SMT Dip Decode Slide Switch 8 Pin 1.27 Pitch Switching 25mA, 24VDC Non-switching 100mA, 50VDC Initial 50m Ω Max. After Life Te...

... Polymide film, also known as film, is a versatile product used in various industries for its unique properties and applications. It is a...

... foil) (ED or RA copper foil), A (Adhesive) (acrylic and epoxy resin thermosetting adhesive) ) And PI (Kapton, Polyimide) (polyimide film) composed...

... foil) (ED or RA copper foil), A (Adhesive) (acrylic and epoxy resin thermosetting adhesive) ) And PI (Kapton, Polyimide) (polyimide film) composed...

...e: Hybrid metal bond diamond grinding wheel Product Description: These wheels hold their form better than conventional, , or bonds, ...

... are highly versatile components used in the development of complex electronic systems. They are the backbone of modern electronics. Specialized ma...

... Material, rigid flex circuit boards structure Product Type: Bluetooth headset Smallest hole Material: DuPont PI+ cover film Line width an...