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Insulation electric LED LED LED is a hig...
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... For Electronic Devices Ziitek company is a manufacturer of gap fillers, low melting point therma...
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... are desired. Its unique grain-oriented, plate-like structure provides a high of 240 W/mK in the XY plane and 5 W/mK through t...
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Custom heat dissipation Product Introduction Heat-dissipating silica gel is a material wit...
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... interface material is high-performance, gap filling materials. Mainly for the transmis...
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... Interface A interface , also known as a pad or interface material (TIM)...
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... Material is an innovative solution designed for a wide array of applications that require efficient heat dissipation. This adv...
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... versus deflection characteristics. The combination will allow minimal stress on components while also yielding low resistance. As a result...
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Potting Compounds Two-component potting compound sealant for electronic component ∎Product Description ●SI8230 ...
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... amount of metal oxides. This combination improves high , low oil separation rate and high temperature stabi...
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...room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate ther...
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... of processes made of a special ceramic, the following first understand the fine characteristics of carbide ceramics: carbide ceram...
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